EHF Signal Splicing for Contactless PCB Interconnects

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Solution Overview

Problem

Conventional mechanical connectors in electronic systems introduce impedance discontinuities, degrade signal quality, are bulky, and prone to wear, making them inefficient for high-speed data transfer between printed circuit boards.

Innovation Solution

The use of Extremely High Frequency (EHF) communication circuits that enable contactless signal splicing between electronic devices by converting communication signals into EHF electromagnetic signals, allowing for secure, stable, and high-bandwidth data transfer without the need for physical connectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional mechanical connectors are used for signal transfer between PCBs, then physical connection is established, but impedance discontinuities occur and signal quality degrades

Engineering Contradiction:
Improvesignal qualityVSAvoidconnector architecture
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces mechanical connectors with electromagnetic field-based wireless communication. EHF communication circuits transmit signals through electromagnetic fields instead of physical electrical contacts, eliminating mechanical impedance discontinuities and their associated signal quality degradation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces electromagnetic fields as an intermediary medium for signal transmission. Instead of direct electrical contact through mechanical connectors, signals are transmitted through EHF electromagnetic fields that couple between transmitter and receiver circuits, avoiding physical connection issues.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If mechanical connectors are used for data transfer, then connection is established, but the device becomes bulky

Engineering Contradiction:
Improvedata transfer capabilityVSAvoiddevice dimensions
Core Design Contradiction:
Ease of operationVSVolume of moving object

Solution Approach 1:

The patent eliminates bulky mechanical connector structures by substituting them with compact EHF communication circuits. These circuits use electromagnetic field propagation instead of physical signal paths, dramatically reducing the space required for data transfer functionality.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from three-dimensional mechanical connector structures to two-dimensional electromagnetic field propagation. By moving the signal transmission medium from physical space (requiring connectors) to electromagnetic space (propagating through air), the patent reduces dimensional requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If conventional mechanical connectors are used, then signal path is established, but connectors wear out and require precise alignment

Engineering Contradiction:
Improveconnection stabilityVSAvoidalignment precision
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces mechanical contact-based connections with electromagnetic field-based wireless communication. This substitution eliminates wear mechanisms inherent in mechanical connectors and removes alignment precision requirements, as electromagnetic fields can be precisely directed without physical contact.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces dynamic electromagnetic field coupling that can adapt to slight position variations. Unlike rigid mechanical connectors requiring precise static alignment, EHF communication circuits can maintain signal integrity through dynamic field adjustment and tolerance to positional variations.

Inventive Principle:
Principle #15Dynamics

4Productivity

If mechanical connectors are used for high-speed data transfer, then physical connection is provided, but impedance discontinuities require expensive electronics

Engineering Contradiction:
Improvedata transfer speedVSAvoidsignal integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent replaces mechanical connector-based signal paths with EHF electromagnetic field transmission. This substitution eliminates the impedance discontinuities inherent in mechanical connectors, allowing high-speed data transfer without requiring expensive impedance-matching electronics.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes EHF frequency parameters (extremely high frequency electromagnetic waves) to achieve high-speed data transfer. By operating in the EHF band, the system achieves gigabit-per-second transfer rates while maintaining signal integrity through electromagnetic field propagation rather than mechanical electrical contacts.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides reliable, high-bandwidth, and secure data transfer between electronic devices, eliminating the bulk and reliability issues associated with mechanical connectors while maintaining signal integrity.

Implementation Method 1

an extremely high frequency (EHF) communications circuit configured to receive an EHF electromagnetic signal from an external device and generate from the received EHF electromagnetic signal a receive communication signal

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS9647715B2Contactless signal splicing using an extremely high frequency (EHF) communication link
Publication Date: 2017.05.09 MOLEX INC
  • US9647715B2 patent drawing
  • US9647715B2 patent drawing
  • US9647715B2 patent drawing

AI summary

A first electronic device includes a first electronic circuit and a second electronic circuit. The first electronic device may include an internal communication link providing a signal path for conducting communication signals between the first electronic circuit and the second electronic circuit. An interface circuit may be operatively coupled to the internal communication link. The interface circuit may include an extremely high frequency (EHF) communications circuit configured to receive an EHF electromagnetic signal from another EHF communications circuit of a second electronic device. This EHF electromagnetic signal may enable the second electronic device to control or monitor the first electronic device.