EHF Wireless Links for Cableless Chassis Communication

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Solution Overview

Problem

The installation and maintenance of extensive cabling in data centers for server communication are time-consuming, prone to errors, and costly, with significant expenses for cables and connectors, particularly in high-speed environments like cloud-based services.

Innovation Solution

The implementation of Extremely High Frequency (EHF) wireless communication links using millimeter-wave transceiver chips to facilitate cableless connections between server blades and storage arrays, eliminating the need for physical cabling by transmitting data through holes in metal and plastic layers within chassis configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If extensive cabling is used for server communication in data centers, then reliable data transmission is achieved, but installation time and labor costs increase significantly

Engineering Contradiction:

Improvedata transmission reliabilityVSAvoidinstallation time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the mechanical cabling system with a wireless communication system using EHF transceiver chips. These chips establish wireless links between server blades and storage arrays, eliminating the need for physical cable connections while maintaining data transmission reliability through standardized wireless protocols and error correction mechanisms.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces EHF transceiver chips as intermediary devices that facilitate communication between server components. These chips act as wireless mediators, transmitting data signals through designated pathways in the chassis structure without requiring direct physical cable connections between devices.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If extensive cabling is installed for high-speed server communication, then data transmission capacity is sufficient, but cabling errors and installation complexity increase

Engineering Contradiction:

Improvedata transmission capacityVSAvoidcabling complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent substitutes the complex mechanical cabling infrastructure with wireless EHF communication. The transceiver chips handle high-speed data transmission through electromagnetic waves, eliminating the need for numerous cables, connectors, and routing configurations that contribute to installation complexity and potential errors.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The EHF transceiver chips provide universal communication capability across different server components. A single wireless communication standard and chip design can handle various data transmission requirements (storage, networking, processing) that would otherwise require different cable types and connection methods, simplifying the overall system architecture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Productivity

If high-speed cabling is deployed for cloud service infrastructure, then network bandwidth is adequate, but cable and connector costs become significant

Engineering Contradiction:

Improvenetwork bandwidthVSAvoidcable material quantity

Core Design Contradiction:

ProductivityVSQuantity of substance

Solution Approach 1:

The patent replaces physical cable infrastructure with wireless EHF communication technology. The transceiver chips transmit high-bandwidth data signals through the air, eliminating the need for expensive high-speed cables and connectors while maintaining adequate network bandwidth for cloud service operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts the communication function from the physical cable medium and relocates it to wireless electromagnetic transmission. By removing the cable and connector components entirely, the system eliminates the material costs associated with these items while preserving the essential data transmission capability through alternative wireless pathways.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces system and labor costs, prevents cabling errors, and allows for easier maintenance and upgrades by enabling wireless communication between components in data centers, enhancing data transfer efficiency and reducing installation complexities.

Implementation Method 1

EHF transceiver chips that facilitate a plurality of millimeter-wave wireless links

Methodology Applied

Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS10541941B2Cableless connection apparatus and method for communication between chassis

Publication Date: 2020.01.21 INTEL CORP

AI summary

Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.