EHF Wireless PCB Interconnect via Modulation Circuit
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Solution Overview
Problem
Conventional connector and backplane architectures in electronic systems introduce impedance discontinuities, degrading signal quality and requiring expensive electronics to negotiate, while mechanical connectors are prone to wear and alignment issues.
Innovation Solution
A system for communicating modulated EHF signals using a modulation circuit and transducer to convert bi-level transmit information signals into electromagnetic signals, and a demodulation circuit to regenerate information signals from received electromagnetic signals, reducing power consumption and eliminating mechanical connectivity issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mechanical connectors and backplane architectures are used to connect PCBs, then electrical connectivity between boards is established, but impedance discontinuities occur degrading signal quality and mechanical wear and alignment issues arise
Solution Approach 1:
The patent replaces mechanical connectors and backplane architectures with wireless electromagnetic field communication at EHF frequencies. Transducers convert electrical signals to electromagnetic waves for transmission through air or vacuum, eliminating physical contact points, impedance discontinuities, and mechanical wear issues while maintaining data transmission functionality between PCBs
Solution Approach 2:
The patent introduces electromagnetic waves as an intermediary medium to transfer information between PCBs. The transducers act as converters that transform electrical signals into electromagnetic waves for transmission and back into electrical signals at the receiving end, providing a non-contact communication pathway that avoids the problems of direct mechanical electrical connections
2Productivity
If conventional mechanical connectors are used for PCB connectivity, then electrical signals can be transmitted between boards, but the connectors wear out over time and require precise alignment and manufacturing
Solution Approach 1:
The patent replaces mechanical connectors with wireless EHF communication transducers that transmit data through electromagnetic fields. This eliminates the need for precise mechanical alignment and manufacturing tolerances required by conventional connectors, while maintaining high-speed data transmission capability between PCBs
3Productivity
If high-speed ICs process increasingly larger amounts of data at higher speeds, then functionality is enhanced, but power consumption increases
Solution Approach 1:
The patent employs spread spectrum modulation techniques that distribute the data transmission energy across a wide frequency range using pseudo-random code sequences. This periodic spreading and processing of signals enables efficient data transmission at EHF frequencies while reducing peak power requirements and improving energy utilization efficiency compared to conventional continuous high-power transmission methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances signal integrity and reduces power consumption by using wireless communication between IC packages, eliminating mechanical degradation and alignment challenges, and providing efficient data transmission across PCBs.
Implementation Method 1
A transmit transducer operatively coupled to the modulation circuit may be responsive to the transmit output signal for converting the transmit output signal into an electromagnetic signal
Implementation Method 2
A receive transducer responsive to an electromagnetic signal having the EHF frequency for converting the electromagnetic signal into a receive input signal
Data Source
AI summary
A system for communicating modulated EHF signals may include a modulation circuit responsive to a bi-level transmit information signal for generating a transmit output signal. The transmit output signal may have an EHF frequency when the transmit information signal is at a first information state and may be suppressed when the transmit information signal is at a second information state. A transmit transducer operatively coupled to the modulation circuit may be responsive to the transmit output signal for converting the transmit output signal into an electromagnetic signal.