EIC-PIC Integration With Targeted Micro-Thermoelectric Cooling
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Solution Overview
Problem
The integration of electronic and photonic integrated circuits faces significant thermal management challenges due to differing thermal profiles and temperature control requirements, leading to inefficient heat dissipation and increased costs in transceiver packaging, particularly in high-bandwidth applications like 400G and 800G modules, where parasitic heat loads and temperature sensitivity of active photonic components necessitate larger footprints and energy inefficiencies.
Innovation Solution
A thermal management system using a silicon-on-glass substrate with a lid bonded via heat-free mechanisms, incorporating micro-thermoelectric modules and heat-dissipating fins to target cooling to specific components, while maintaining hermetic sealing and efficient heat removal, thereby reducing energy consumption and component footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermoelectric coolers are used for thermal management, then temperature control is achieved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the thermal management function from traditional bulky thermoelectric coolers and implements it through integrated micro-thermoelectric modules embedded within the substrate structure. This separation of the cooling function from the main device allows for simplified integration while maintaining effective temperature control.
Solution Approach 2:
The patent applies local quality by positioning micro-thermoelectric modules specifically at locations where heat generation is most critical, rather than using uniform cooling across the entire device. This localized approach reduces overall device complexity while maintaining effective temperature control where needed.
2Manufacturing precision
If heat-free bonding mechanisms are used for the lid, then manufacturing precision is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical bonding methods with heat-free bonding mechanisms such as adhesive bonding or friction stir welding. This substitution eliminates thermal stress and distortion associated with conventional bonding, improving manufacturing precision while the automated nature of these processes actually reduces overall manufacturing complexity.
3Use of energy by moving object
If micro-thermoelectric modules are used for targeted cooling, then energy efficiency is improved, but device complexity increases
Solution Approach 1:
The patent segments the thermal management system into multiple independent micro-thermoelectric modules distributed across the substrate. Each module independently manages heat at its local location, improving overall energy efficiency by cooling only where necessary. The modular design actually reduces complexity compared to a single large cooling system.
Solution Approach 2:
The patent embeds micro-thermoelectric modules within the substrate structure itself, nesting the cooling function within the device architecture. This integration reduces the overall device footprint and complexity while maintaining high energy efficiency through targeted cooling.
4Reliability
If hermetic sealing is implemented, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the hermetic sealing function with the substrate and lid structure itself, rather than adding separate sealing components. The lid is designed to mate with the substrate to form an integrated hermetic enclosure, improving reliability while simplifying manufacturing through reduced part count and assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves efficient temperature control and heat removal, reducing energy consumption by up to 50% and minimizing the footprint of integrated circuits, enabling compact and energy-efficient operation of photonic and electronic components.
Implementation Method 1
at least one micro-thermoelectric module (μTEM) for temperature controlling the active photonic device
Implementation Method 2
an array of heat-dissipating fins (64) covering the electric or electronic component (50) from the Electronic Integrated Circuit (EIC)
Implementation Method 3
an array of heat-dissipating fins (64) covering the electric or electronic component (50)
Implementation Method 4
said lid (6) defining a lidded cavity (63) in which the heat generating components (5) are encapsulated
Data Source
Figure 1~2b
Figure 3~4
Figure 5~6
AI summary
The present application relates to EIC-INTEGRATED PICs. More particularly, various embodiments relate to EIC-INTEGRATED PICs enabling effective thermal management temperature control and heat removal.