EIC-PIC Integration With μTEC Cooling for Thermal Crosstalk Control
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Solution Overview
Problem
The integration of photonic and electronic components into a single photonic integrated circuit (PIC) is hindered by parasitic thermal crosstalk effects, which existing thermal management solutions, such as micro-thermoelectric coolers, do not adequately address, especially in high-switching-frequency applications.
Innovation Solution
An apparatus integrating an Electronic Integrated Circuit (EIC) and a photonic-integrated circuit (PIC) with a glass substrate, metal vias for electrical connections, a thermally conductive lid with heat-dissipating fins, and a micro-thermoelectric module for effective thermal management, utilizing thermal interfaces to manage heat from heat-generating components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If photonic and electronic components are densely integrated into a single PIC, then integration density and functionality are improved, but thermal crosstalk between components increases
Solution Approach 1:
The patent divides the integrated circuit into separate functional layers: a photonic integrated circuit layer and an electronic integrated circuit layer, with each layer handling specific functions. This segmentation allows independent thermal management for each layer, reducing thermal crosstalk while maintaining high integration density through vertical stacking of functional components.
Solution Approach 2:
The patent introduces a dedicated thermal management layer containing micro-thermoelectric coolers (μTECs) that acts as an intermediary between heat-generating photonic components and heat-sensitive electronic components. This thermal management layer actively controls temperature distribution, preventing thermal crosstalk while enabling dense integration of photonic and electronic functions.
2Temperature
If micro-thermoelectric coolers are integrated for thermal management, then temperature control is improved, but device complexity and footprint increase
Solution Approach 1:
The patent merges the thermal management function with the interconnection structure by integrating μTECs into the existing layered architecture. The thermal management layer is combined with electrical interconnection layers, allowing shared structural support and reduced overall device complexity despite the addition of active cooling functionality.
Solution Approach 2:
The thermal management layer serves multiple functions: it provides active cooling through μTECs, acts as an electrical interconnection plane, and serves as a structural support layer. This multi-functionality reduces the need for separate dedicated components, thereby reducing overall device complexity while maintaining effective temperature control.
3Speed
If switching frequency is increased for high-speed applications, then data transmission speed is improved, but heat generation from components increases
Solution Approach 1:
The patent introduces a dedicated thermal management layer with μTECs that acts as an intermediary to actively remove heat generated by high-speed photonic and electronic components. This layer provides continuous thermal control that enables sustained high switching frequencies without excessive heat accumulation, maintaining energy efficiency at high speeds.
Solution Approach 2:
The patent implements localized thermal management by positioning μTECs specifically beneath heat-generating photonic components and electronic components. This targeted approach provides intensive cooling where needed while minimizing overall energy consumption, enabling high switching frequencies in critical areas without uniformly increasing power consumption across the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient thermal management, reducing energy consumption and footprint, while allowing for high-speed operations in various applications like telecommunications and environmental sensing, by effectively isolating and dissipating heat from both EIC and PIC components.
Implementation Method 1
a micro-thermoelectric module (μTEM) for temperature controlling said at least one heat generating component from the photonic-integrated circuit
Implementation Method 2
The lid and, if applicable, the heat-dissipating fins may be made of a thermally conductive material, preferably consisting of a metal or silicon
Data Source
AI summary
The present application relates to EIC-INTEGRATED PICs. More particularly, various embodiments relate to EIC-INTEGRATED PICs enabling effective thermal management temperature control and heat removal.