EIC-PIC Integration Layout for Thermal Crosstalk Isolation
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Solution Overview
Problem
The integration of photonic and electronic components into a single photonic integrated circuit (PIC) is hindered by parasitic thermal crosstalk effects, which complicates effective thermal management and heat removal.
Innovation Solution
An apparatus integrating an Electronic Integrated Circuit (EIC) and at least one photonic-integrated circuit (PIC) is designed, featuring a glass substrate with an electrical interconnection plane, a silicon-on-insulator (SOI) layer, metal vias for electrical connections, and a lid with heat-dissipating fins for thermal management, including a micro-thermoelectric module for temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photonic and electronic components are integrated into a single PIC, then device functionality and switching frequency are improved, but thermal crosstalk effects worsen
Solution Approach 1:
The apparatus divides the integrated circuit into separate functional layers: a first substrate layer for electronic components (EIC) and a second substrate layer for photonic components (PIC). This spatial segmentation allows each layer to be optimized independently while reducing thermal interference between the two types of components, thus maintaining high switching frequency while mitigating thermal crosstalk.
Solution Approach 2:
A dedicated thermal management layer containing micro-thermoelectric coolers (pTECs) is introduced as an intermediary between the photonic and electronic layers. This intermediate layer actively manages heat transfer, preventing thermal crosstalk from the EIC layer from affecting the sensitive PIC layer, thereby enabling high-speed operation without thermal interference.
2Temperature
If a thermal management layer with pTECs is integrated, then thermal management capability is improved, but device complexity increases
Solution Approach 1:
The thermal management layer with pTECs serves multiple functions simultaneously: it provides active cooling for the photonic components, acts as a thermal isolation barrier between layers, and can be integrated with the existing multi-substrate architecture. This multi-functionality justifies the added complexity by delivering comprehensive thermal management solutions across different operational requirements.
Solution Approach 2:
The pTEC elements are integrated within the existing multi-layer substrate structure, nesting the thermal management functionality within the broader device architecture. The thermal management layer is positioned between the first substrate (EIC) and second substrate (PIC), effectively embedding cooling capability within the integrated circuit without requiring separate external cooling systems.
3Object-affected harmful factors
If multiple substrates are used for EIC and PIC, then thermal isolation is improved, but manufacturing complexity increases
Solution Approach 1:
The apparatus employs separate first and second substrates for EIC and PIC fabrication respectively, allowing each substrate to be manufactured using optimized processes for its specific component type. The substrates are subsequently bonded together with the thermal management layer in between, achieving thermal isolation while maintaining manufacturing efficiency through specialized process optimization for each layer.
Solution Approach 2:
The thermal management layer with pTECs serves as an intermediary bonding layer between the two substrates. This intermediate layer not only provides thermal isolation but also facilitates mechanical bonding and electrical interconnection between the EIC and PIC layers, simplifying the overall manufacturing process by combining multiple functions in a single intermediate layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective thermal management and heat removal, allowing for the design of a common technology platform for various photonic integrated circuits, enhancing their performance in applications such as fibre optic environmental sensing and high-speed transceivers.
Implementation Method 1
The lid and, if applicable, the heat-dissipating fins may be made of a thermally conductive material, preferably consisting of a metal or silicon
Implementation Method 2
a micro-thermoelectric module (μTEM) for temperature controlling said at least one heat generating component
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The present application relates to EIC-INTEGRATED PICs. More particularly, various embodiments relate to EIC-INTEGRATED PICs enabling effective thermal management temperature control and heat removal.