Electronic Ink Display Edge Sealant Curing via Segmentation

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Solution Overview

Problem

Conventional electronic-ink display manufacturing methods face challenges in fully solidifying the edge sealant due to shielding by the dielectric layer and protective sheet, leading to longer curing times and reduced reliability.

Innovation Solution

The use of an ultraviolet curable or electromagnetic radiation curable sealant is applied to the side wall of the electronic-ink layer, with at least one part not overlaid above the dielectric layer, allowing direct irradiation from below to facilitate complete curing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the edge sealant is coated on the side wall of the electronic-ink layer and the dielectric layer is placed below it, then the edge sealant can be cured by UV light irradiation from below, but the dielectric layer shields the UV light preventing complete curing of the edge sealant

Engineering Contradiction:
Improvecuring completeness of edge sealantVSAvoidUV light shielding by dielectric layer
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The edge sealant is divided into two parts: a first edge sealant portion not overlaid above the dielectric layer that receives UV light from below for curing, and a second edge sealant portion overlaid above the dielectric layer that is cured by UV light from the side. This segmentation allows each portion to be cured by appropriate UV light exposure, resolving the shielding problem.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The curing approach is changed from single-direction (from below only) to multi-directional (from below for the first portion and from the side for the second portion). This dimensional change in light irradiation approach allows the dielectric layer's shielding effect to be overcome by curing different portions from different directions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If a protective sheet is disposed above the front plane laminate to protect it, then the protective sheet shields UV light preventing curing of the edge sealant, but removing the protective sheet compromises the protection

Engineering Contradiction:
Improveprotection of front plane laminateVSAvoidUV light shielding by protective sheet
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The edge sealant is segmented into portions that receive UV light from different directions, allowing the protective sheet to remain in place while still enabling complete curing. The first portion is cured from below through the substrate, and the second portion is cured from the side, eliminating the need to remove the protective sheet.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate acts as an intermediary that allows UV light to pass through from below to cure the first edge sealant portion, while the protective sheet remains above to protect the front plane laminate. This intermediary approach allows both protection and curing to coexist.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If the edge sealant is completely overlaid above the dielectric layer for structural support, then the structural integrity is improved, but the UV light cannot penetrate through the dielectric layer to cure the edge sealant

Engineering Contradiction:
Improvestructural integrity of edge sealantVSAvoidcuring effectiveness of edge sealant
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The edge sealant is divided into a first portion that is not overlaid above the dielectric layer and a second portion that is overlaid. The first portion provides structural support and is cured from below, while the second portion is cured from the side, allowing both structural integrity and curing effectiveness to be achieved.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the edge sealant have different positions relative to the dielectric layer: the first portion is positioned to receive UV light from below for curing, while the second portion is positioned above the dielectric layer for structural support and is cured from the side. This local quality differentiation resolves the contradiction between structural integrity and curing effectiveness.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures the edge sealant receives sufficient radiation for full curing, enhancing the reliability and efficiency of the electronic-ink display manufacturing process.

Implementation Method 1

An ultraviolet curable sealant which can be solidified by electromagnetic radiation such as ultraviolet (UV) light is subsequently coated on the side wall of the electronic-ink layer. Finally, the edge sealant is irradiated with UV light or visible light to carry out the curing reaction of the edge sealant.

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS7884363B2Electronic-ink display apparatus and the manufacturing method thereof
Publication Date: 2011.02.08 E INK HLDG INC
  • US7884363B2 patent drawing
  • US7884363B2 patent drawing
  • US7884363B2 patent drawing

AI summary

An electronic-ink display apparatus is provided. The electronic-ink display apparatus includes a thin film transistor (TFT) array substrate, an electronic-ink layer, a common electrode, a second substrate and an edge sealant. The TFT array substrate includes a first substrate and a dielectric layer located above the first substrate. The electronic-ink layer, common electrode and second substrate are located above TFT array substrate in sequence. The edge sealant surrounds the electronic-ink layer and at least one part of the edge sealant is not overlaid above the dielectric layer.