Ejectable Tray Assemblies for Compact Electronic Devices
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Solution Overview
Problem
Manufacturing variations in electronic devices lead to inconsistencies in the distance between the circuit board and the housing opening, resulting in an uneven profile and increased device size due to variations in ejectable component assemblies, affecting the functionality and aesthetics of removable modules.
Innovation Solution
A compact ejectable component assembly is designed with a tray retained between a circuit board and a cage, utilizing a wafer for electrical connection, a retaining plate with extensions for guiding and retaining the tray, and a compression spring for ejection, along with an ejection mechanism involving an ejection arm and actuating arm to ensure smooth insertion and removal of removable modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If manufacturing variations are not compensated, then the device structure remains simple, but the profile becomes abrupt and the device size increases
Solution Approach 1:
The patent introduces a tray as an intermediary component between the module and the housing opening. The tray includes a protrusion that extends into the housing, which acts as a mediator to compensate for manufacturing variations. This protrusion can be positioned at different depths to accommodate variations in the distance between the circuit board and the housing opening, thereby maintaining a smooth profile without requiring complex adjustment mechanisms.
2Manufacturing precision
If the ejector is positioned farther from the user, then the device can accommodate manufacturing variations, but the device size increases
Solution Approach 1:
The patent resolves the spatial conflict by transitioning the ejection mechanism from a linear extension to a rotational motion around a pivot point. The ejector arm pivots about a pivot point located within the housing, allowing the ejection force to be applied at a distance from the module while maintaining a compact overall device height. This rotational dimension enables the ejector to reach the module without increasing the device's external dimensions.
3Reliability
If a complex ejection mechanism is used to eject the tray, then the tray can be reliably ejected, but the device size and complexity increase
Solution Approach 1:
The patent extracts the ejection function from a complex integrated mechanism and implements it through a simple lever arm system. The ejector arm is a separate, simple component that pivots about a fixed point and applies force directly to the tray. This extraction of the ejection function into a dedicated, simple lever mechanism achieves reliable ejection while minimizing the overall complexity of the device.
4Device complexity
If the tray is retained with simple structures, then the device complexity is reduced, but the module may slip during removal
Solution Approach 1:
The patent employs asymmetric retention features including a ramp and a detent positioned at specific locations on the tray. The ramp is positioned to engage the module during insertion and prevent slippage during removal, while the detent provides a mechanical stop to secure the tray in its inserted position. These asymmetric features are strategically placed to provide reliable retention and prevent module slippage without requiring complex retention mechanisms throughout the entire tray structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the compactness and functionality of electronic devices by maintaining a consistent profile, ensuring secure module retention and efficient ejection, while reducing the overall device height and preventing module slippage, thus addressing manufacturing inconsistencies and user experience.
Implementation Method 1
The compression spring may compress when the tray is inserted into the assembly and decompress when the springs disengage from the detent to assist in ejecting the tray from the assembly
Implementation Method 2
The wafer may be electrically coupled to the circuit board and that extends into the opening in the tray to contact the module
Data Source
AI summary
Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.