Liquid Ejecting Head Wiring Layout for Releasable Chip Replacement
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Solution Overview
Problem
Existing liquid ejecting heads face challenges in easily releasing electrical couplings between head chips and relay substrates, leading to unnecessary discarding of functional components when one fails, and damage during forced separation, which limits reusability.
Innovation Solution
Incorporating a flexible wiring member with adhered and bonded terminal groups that are compatible with the relay substrate, allowing for selective disconnection without damage, and a common wiring group for head chips to facilitate modular replacement and reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the relay substrate and wiring member are bonded to each other to reduce electrical coupling portions, then the electrical connection is improved, but it becomes difficult to release the electrical coupling between head chip and relay substrate
Solution Approach 1:
The wiring member is divided into multiple terminal groups (first terminal group A, second terminal group B, third terminal group C) with different bonding states. Terminal group A is bonded to the relay substrate for electrical connection, while terminal groups B and C remain unbonded to enable selective release and replacement of the head chip without damaging the relay substrate.
2Ease of repair
If forced release of bonding between relay substrate terminal and wiring member terminal is performed, then the electrical coupling can be released, but the terminals are damaged and cannot be reused
Solution Approach 1:
The wiring member is pre-configured with terminal groups that have different bonding characteristics. Terminal groups B and C are intentionally left unbonded during assembly, creating a predetermined weak point that allows for clean separation without forcing the bonded terminal group A, thus preventing damage to the relay substrate terminal.
3Reliability
If the relay substrate and wiring member are adhered by conductive adhesive, then electrical coupling is achieved, but the bonding cannot be easily released without damage
Solution Approach 1:
Different portions of the wiring member have different bonding qualities: terminal group A uses strong conductive adhesive bonding for reliable electrical connection, while terminal groups B and C use no bonding or weak bonding, creating localized differences in bond strength that enable selective release of the head chip while preserving the relay substrate.
Data Source
AI summary
A liquid ejecting head includes a first head chip that includes a first wiring member having flexibility, and a relay substrate that includes a first terminal group α and is electrically coupled to the first wiring member. The first wiring member includes a first terminal group A that is adhered or bonded to the first terminal group α of the relay substrate, and a first terminal group B that is not adhered or bonded to the relay substrate, and the first terminal group A is compatible with the first terminal group B.