Liquid Ejecting Head Fixing Plate Deformation Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid ejecting heads, such as ink jet recording heads, face issues with deformation of the fixing plate due to external forces applied during cap sealing or medium contact, which can crush the adhesive filling the gap between the head chip and the holder, leading to misalignment and performance problems.
Innovation Solution
The liquid ejecting head is designed with a first head chip having nozzles, a holder, and a fixing plate. A first adhesive surface with an opening of a flow passage is provided on the head chip, and a second adhesive surface with an opening of a flow passage is on the holder. These adhesive surfaces adhere with a first adhesive to form a coupling flow passage, and contact portions on the head chip and holder ensure precise alignment, with the dimension between these contact portions being smaller than the adhesive surfaces, thereby preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the opening is sealed with a cap, then the liquid ejection function is protected, but external force is applied to the fixing plate causing deformation
Solution Approach 1:
The patent divides the fixing structure into multiple functional zones: a first fixing portion that rigidly fixes the head chip to prevent deformation, and a second fixing portion that provides flexible fixing. This segmentation allows the fixing plate to maintain structural integrity while accommodating external forces from cap sealing without transmitting them to the head chip.
Solution Approach 2:
Different regions of the fixing plate are designed with different fixing characteristics. The first fixing portion (near the head chip) provides rigid fixing with high positional accuracy, while the second fixing portion (peripheral region) provides flexible fixing that can absorb external forces. This local differentiation of fixing quality prevents deformation while maintaining ejection function protection.
2Force
If external force is applied to the fixing plate, then the adhesive is crushed, but the head chip is pushed closer to the holder causing misalignment
Solution Approach 1:
The fixing plate is divided into a first fixing portion that directly contacts and rigidly secures the head chip, and a second fixing portion that provides flexible support. This segmentation ensures that external forces are absorbed by the second portion rather than being transmitted to crush the adhesive and misalign the head chip.
Solution Approach 2:
The second fixing portion is designed to provide beforehand cushioning against external forces. By providing a flexible fixing region in advance, the structure can absorb compressive forces from cap sealing or medium contact before they reach the adhesive layer, preventing both adhesive crushing and head chip misalignment.
3Strength
If the adhesive filling the space is used for fixing, then the head chip adheres to the holder, but the adhesive is crushed under external force
Solution Approach 1:
The fixing function is segmented between the adhesive (providing bonding strength) and the fixing plate structure (providing force resistance). The first fixing portion uses both adhesive and rigid structure for strong, force-resistant fixing, while the second fixing portion uses flexible structure for force absorption, protecting the adhesive from crushing.
Solution Approach 2:
The fixing plate acts as an intermediary between the adhesive bonding system and external forces. By introducing this intermediate structural element with differentiated fixing portions, external forces are intercepted and managed before they can crush the adhesive, while the adhesive maintains its bonding function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents deformation of the fixing plate by restricting the movement of the head chip due to external forces, ensuring precise alignment and maintaining the integrity of the liquid ejecting mechanism.
Implementation Method 1
a first adhesive surface and a second adhesive surface adhere to each other with adhesive so as to define a coupling flow passage
Data Source
AI summary
A first-adhesive surface is provided on an upper portion of a head chip, a holder accommodates the head chip between the holder and a fixing plate and has a second-adhesive surface formed with an opening of a second-supply flow passage communicating with the head chip, the first-adhesive surface and the second-adhesive surface adhere to each other with a first-adhesive so as to define a coupling flow passage coupling between a first-supply flow passage and the second-supply flow passage, the upper portion of the head chip has a first-contact portion, the holder has a first-contacted portion facing the first-contact portion, and a first-dimension between the first-contact portion and the first-contacted portion is smaller than a second-dimension between the first-adhesive surface and the second-adhesive surface.