Liquid Droplet Ejecting Head Reinforcing Member Design
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Solution Overview
Problem
The existing liquid droplet ejecting heads face challenges in securing sufficient strength of the first substrate while avoiding increased size, particularly due to the direct connection of the second substrate, which compromises the reinforcing member's placement and leads to reduced strength and increased cost.
Innovation Solution
A liquid droplet ejecting head design that includes a reinforcing member on the first substrate, with the second substrate mounted on this reinforcing member via a metal wire, allowing for improved strength and reduced size without degrading adhesives or water-repellent films, using wire bonding for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the second substrate is directly pasted onto the first substrate, then the construction method is simplified, but the strength of the connecting portion decreases and the first substrate requires larger openings increasing its size
Solution Approach 1:
The patent introduces a reinforcing member as an intermediary component between the first substrate and the second substrate. This reinforcing member is pasted onto the first substrate at the connecting portion, providing additional mechanical support and strength to the connection area without requiring larger openings in the first substrate. The reinforcing member acts as a mediator that distributes stress and reinforces the connection without complicating the overall construction method.
2Ease of manufacture
If the second substrate is directly pasted onto the first substrate, then the construction method is simplified, but the size of the first substrate increases due to larger openings required
Solution Approach 1:
The reinforcing member serves as a mediator that provides the necessary structural support at the connecting portion, allowing the first substrate to maintain its original size without requiring enlarged openings. The reinforcing member compensates for the structural weakness that would otherwise necessitate larger openings, thus preventing an increase in the overall size of the first substrate.
Solution Approach 2:
The patent segments the structural support function by separating it from the first substrate itself and placing it in a distinct reinforcing member. This segmentation allows the first substrate to remain compact while the reinforcing member provides the necessary structural support at the connecting portion, avoiding the need for the first substrate to increase in size.
3Reliability
If soldering or wire bonding is used to join the first wiring member and second wiring member, then electrical connection is achieved, but heat generation may damage the water-repellent film and adhesive
Solution Approach 1:
The patent extracts the harmful thermal effect from the electrical connection process by eliminating soldering, which generates excessive heat. Instead, the invention uses a conductive adhesive that forms electrical connections without requiring high-temperature processing, thereby taking out the harmful heat generation aspect while maintaining the essential function of electrical connection between the first wiring member and second wiring member.
Solution Approach 2:
The patent changes the parameter of connection temperature by replacing soldering (high temperature) with conductive adhesive bonding (low or room temperature). This parameter change eliminates the heat generation issue that would damage the water-repellent film and adhesive, while still achieving reliable electrical connection through the conductive properties of the adhesive material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the strength of the connecting portion between substrates, reduces the size and cost of the first substrate, and maintains reliability by avoiding high-temperature degradation of adhesives and water-repellent films.
Implementation Method 1
an electromechanical transducer element; a first substrate which includes a first wiring member... wherein liquid droplets are ejected when driving power is supplied to the electromechanical transducer element
Implementation Method 2
a method of joining the first wiring member and the second wiring member with wire bonding may be adopted
Data Source
AI summary
A liquid droplet ejecting head is disclosed. The liquid droplet ejecting head includes an electromechanical transducer element; a first substrate which includes a first wiring member; a reinforcing member which is mounted on the first substrate; and a second substrate which includes a second wiring member and which is mounted on the reinforcing member, wherein liquid droplets are ejected when driving power is supplied to the electromechanical transducer element via the first wiring member and the second wiring member.