Liquid Ejecting Head Insulation Against Static Discharge Contact

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Solution Overview

Problem

In existing liquid ejecting heads, such as those used in inkjet printers, the drive circuit can fail due to static electricity conduction from the holder to the drive circuit when the holder and drive circuit come into contact, which is a result of assembly errors.

Innovation Solution

A liquid ejecting head design that includes a separation member between the holder's inner wall surface and the drive circuit, made of metal, to prevent conduction and protect the drive circuit from static electricity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the holder is made of metal to improve structural strength and grounding, then the reliability of static electricity discharge is improved, but the drive circuit may fail due to static electricity conduction when contact occurs

Engineering Contradiction:
Improvestatic electricity discharge reliabilityVSAvoidstatic electricity conduction to drive circuit
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An insulating structure is introduced as an intermediary element between the metal holder and the drive circuit. This insulating structure prevents direct contact and blocks the conduction path for static electricity, allowing the metal holder to maintain its grounding function while protecting the drive circuit from static electricity damage

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The holder is divided into multiple parts: a metal holder body for structural strength and grounding, and a separate insulating structure (insulating cover or insulating layer) that segments the contact path. This segmentation allows the metal portion to discharge static electricity while the insulating portion prevents conduction to the drive circuit

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If assembly precision is improved to prevent contact between holder and drive circuit, then static electricity conduction is reduced, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveassembly precisionVSAvoidassembly complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The insulating structure is pre-installed on the holder or in the assembly path before the drive circuit is positioned. This preliminary action ensures that even with normal assembly variations, the insulating structure is already in place to prevent contact and static electricity conduction, eliminating the need for high assembly precision

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The insulating structure serves as a mediator that eliminates the need for precise assembly control. By providing a physical barrier that prevents contact regardless of assembly variations, it simplifies the manufacturing process and reduces assembly complexity

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The separation member effectively suppresses conduction between the holder and the drive circuit, enhancing the reliability of the liquid ejecting head by preventing static electricity-induced failures.

Implementation Method 1

a separation member disposed between the first inner wall surface and the first drive circuit, the separation member being configured to suppress conduction between the first inner wall surface and the first drive circuit

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Data Source

PatentUS12508809B2Liquid ejecting head and liquid ejecting apparatus
Publication Date: 2025.12.30 SEIKO EPSON CORP
  • US12508809B2 patent drawing
  • US12508809B2 patent drawing
  • US12508809B2 patent drawing

AI summary

A liquid ejecting head includes a head chip, a wiring substrate including a drive circuit, the wiring substrate being electrically coupled to the head chip, a fixing plate fixed with the head chip, a holder including an inner wall surface facing the drive circuit, the holder being made of a metal, the holder being configured to hold the head chip between the fixing plate and the holder, and a separation member disposed between the inner wall surface and the drive circuit, the separation member being configured to suppress conduction between the inner wall surface and the drive circuit.