Laminated Liquid Ejection Head Bonding Margin Bridge Design
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Solution Overview
Problem
Bonding failures can occur in liquid ejection heads when foreign matter is trapped between laminated plates, particularly around holes functioning as liquid channels, due to insufficient adhesive bonding.
Innovation Solution
The design incorporates individual bonding margins surrounding holes, connected by bonding margin bridges, with defined escape grooves to manage adhesive distribution and prevent excess adhesive from entering the holes, ensuring consistent and effective bonding between plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual bonding margins are formed around holes to prevent adhesive overflow, then adhesive control is improved, but bonding reliability deteriorates when foreign matter is trapped in the bonding area
Solution Approach 1:
The bonding margin is segmented into individual bonding margins surrounding each hole, with bonding margin bridges connecting them. This segmentation allows the adhesive to be distributed through multiple pathways (individual margins and bridges), so that if foreign matter blocks one path, other paths remain open for adequate bonding.
Solution Approach 2:
The bonding margin bridge acts as an intermediary structure that connects individual bonding margins. It provides an additional adhesive distribution pathway and compensates for bonding failures in individual margins caused by foreign matter entrapment, ensuring overall bonding reliability.
2Object-affected harmful factors
If bonding margins are reduced to minimize foreign matter entrapment, then foreign matter entrapment is reduced, but adhesive supply adequacy deteriorates
Solution Approach 1:
The bonding margin structure extends into a bridge configuration that spans between holes, creating an additional dimensional pathway for adhesive distribution. This allows adequate adhesive supply without requiring large bonding margins around each individual hole, thus minimizing foreign matter entrapment areas while ensuring sufficient adhesive reaches all bonding regions.
3Manufacturing precision
If escape grooves are formed to prevent adhesive entry into holes, then adhesive containment is improved, but bonding area is reduced
Solution Approach 1:
The escape groove system is segmented to work in conjunction with individual bonding margins and bridges. The grooves are positioned to channel excess adhesive away from holes without encroaching on the bonding margins or bridges, thereby maintaining adequate bonding area while providing effective adhesive containment through the groove network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of bonding failures by ensuring adequate adhesive supply and preventing foreign matter entrapment, while maintaining efficient ink ejection characteristics by keeping excess adhesive contained.
Implementation Method 1
a liquid ejection head including a laminated body in which a plurality of plates are laminated onto each other via an adhesive
Data Source
AI summary
A liquid ejection head may include a plurality of plates which are laminated via an adhesive. At least one of the plurality of plates may include a plurality of holes which are configured to function as liquid channels. The plate may include a plurality of individual bonding margins which are formed on a surface of the plate, and individually surround the plurality of holes. The plate may include a bonding margin bridge which extends parallel to a direction connecting the plurality of holes to each other, and connect the plurality of individual bonding margins to each other. The plate may include a groove which defines outer edges of the plurality of individual bonding margins and the bonding margin bridge on the surface of the plate.