Liquid Ejection Head Conductive Layer for High Density Mounting
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Solution Overview
Problem
Liquid ejection head bodies face challenges in achieving higher mounting density and further downsizing, as existing three-dimensional packaging technologies limit the compactness and efficiency of inkjet head designs.
Innovation Solution
A liquid ejection head body is designed with a substrate and a channel forming member, featuring a liquid ejection port and a liquid channel, where a conductive layer along the lateral surface of a liquid supply port electrically connects the first and second surface sides, eliminating the need for additional through-holes and enhancing wiring flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If three-dimensional packaging technology with through-electrodes is used to increase mounting density, then the mounting density of devices is raised, but the device complexity increases due to the need for additional through-holes and wiring structures
Solution Approach 1:
The patent merges the liquid supply port structure with the through-electrode function by forming the conductive layer directly on the lateral surface of the liquid supply port. This integration eliminates the need for separate through-holes and additional wiring structures, thereby reducing device complexity while maintaining the through-electrode capability for high mounting density
Solution Approach 2:
The liquid supply port is designed to serve multiple functions: it acts as both a liquid supply channel and a through-electrode for electrical connection. The conductive layer on its lateral surface enables electrical connectivity between front and rear surfaces, making the structure universal and eliminating the need for dedicated through-electrodes
2Reliability
If conventional through-electrode formation is used, then electrical connection is achieved, but parasitic resistance increases due to additional through-holes and wiring paths
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional wiring by placing the conductive layer on the lateral surface of the liquid supply port. This vertical arrangement on the lateral surface shortens the electrical connection path between front and rear surfaces, reducing parasitic resistance while maintaining reliable electrical connection
Solution Approach 2:
The conductive layer is formed on the lateral surface of the liquid supply port during the same manufacturing process step, so the electrical connection path is established in advance. This preliminary formation of the conductive path minimizes additional wiring steps and reduces overall parasitic resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for increased mounting density, reduced parasitic resistance, and improved energy efficiency, enabling further downsizing of the liquid ejection head while simplifying the manufacturing process by eliminating the need for additional through-electrodes.
Implementation Method 1
a conductive layer for electrically connecting the first surface side and the second surface side is arranged along the lateral surface of the liquid supply port
Data Source
AI summary
A liquid ejection head body includes a substrate and a channel forming member arranged on the substrate. The channel forming member has a liquid ejection port for ejecting liquid and a liquid channel communicating with the liquid ejection port, while the substrate has an ejection energy generating element for generating energy for ejecting liquid at a first surface side and a liquid supply port for supplying liquid to the liquid channel in the inside. A conductive layer for electrically connecting the first surface side and a second surface side disposed opposite to the first surface side is arranged along the lateral surface of the liquid supply port.