Liquid Ejection Head Movable Connection Flow Passage Thermal Expansion
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Solution Overview
Problem
Existing liquid ejection heads face challenges with liquid ejection accuracy due to heat-induced linear expansion, which can cause separation of ejection modules from the support member, leading to misalignment and potential liquid leakage.
Innovation Solution
The liquid ejection head is designed with a support member that bonds the ejection module to its surface on the ejection direction side, and a liquid supply unit aligned with the support member, featuring a connection flow passage that is movable relative to the liquid supply unit, allowing for absorption of linear expansion effects and preventing excessive force on the bonding portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the ejection module is bonded to the support member, then liquid ejection accuracy is improved, but the bonding portion is susceptible to separation under Z-direction force and thermal expansion
Solution Approach 1:
The connection flow passage is designed to be movable relative to the liquid supply unit, allowing the system to dynamically adapt to thermal expansion and force conditions while maintaining the bonding stability of the ejection module to the support member
Solution Approach 2:
The system is divided into distinct functional components: the support member with the bonded ejection module, and the movable liquid supply unit connected via a flexible flow passage. This segmentation allows independent optimization of bonding stability and thermal/force accommodation
2Ease of manufacture
If force in the Z direction is applied to connect the ejection unit and liquid supply unit, then connection is achieved, but force acts in a direction that separates ejection modules from the support member
Solution Approach 1:
The connection flow passage acts as an intermediary between the liquid supply unit and the ejection module, allowing force application for connection without directly transmitting separating force to the bonding portion between the ejection module and support member
3Temperature
If the temperature of the liquid ejection head becomes high, then UV ink processing is enabled, but the ejection unit expands due to linear expansion, causing separation force on ejection modules
Solution Approach 1:
The movable connection flow passage is designed to accommodate thermal expansion of the ejection unit, allowing the connection to remain stable while the ejection module maintains its bonding to the support member even at high temperatures required for UV ink processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the separation of ejection modules from the support member, maintaining alignment and preventing liquid leakage even under high-temperature conditions, thus enhancing the reliability and accuracy of liquid ejection.
Implementation Method 1
the support member supports the ejection module such that the ejection module is bonded to a surface of the support member on the ejection direction side
Implementation Method 2
the ejection module and the liquid supply unit are connected to each other by the connection flow passage, which is provided to be movable relative to the liquid supply unit
Data Source
AI summary
A liquid ejection head and a liquid ejection apparatus are designed to suppress separation of ejection modules from a support member. To this end, a liquid supply unit is aligned with respect to the support member to which the ejection modules are bonded. Moreover, in a connection unit of an ejection unit and the liquid supply unit, liquid connection units of the ejection unit are connected to be movable relative to the liquid supply unit.