Liquid Ejection Head Top Surface Connector Extraction
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Solution Overview
Problem
Existing liquid ejection heads face difficulties in mounting and detaching due to the complex arrangement of connectors on both the top and underside of the circuit substrate, leading to challenges in connecting multiple wiring members efficiently.
Innovation Solution
The liquid ejection head design features an electrical circuit substrate with connectors only on the top surface, positioned above the element substrate, allowing for easy connection and detachment by using flexible substrates that pass through openings and bend to connect with the element substrate, reducing the need for extensive wiring on the underside and facilitating easier assembly and disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If connectors are arranged on both the top surface and underside of the circuit substrate, then more wiring members can be connected, but the mounting process becomes difficult and complex
Solution Approach 1:
The patent extracts the connector arrangement from the underside of the circuit substrate, removing the complex wiring configuration that caused mounting difficulties. By taking out the connectors from the bottom surface and retaining them only on the top surface, the patent simplifies the mounting process while maintaining the necessary electrical connections through the flexible substrate that extends from the top surface connectors to the element substrate.
2Adaptability or versatility
If connectors are arranged on both surfaces of the circuit substrate, then more electrical connections are possible, but the device complexity increases
Solution Approach 1:
The patent removes the complex wiring configuration from the underside of the circuit substrate by extracting the connector arrangement from that location. The electrical connections are maintained through a flexible substrate that extends from the top surface connectors, eliminating the need for complex wiring on the bottom face and reducing overall device complexity.
Solution Approach 2:
The patent employs a flexible substrate that acts as a thin film connector between the top surface connectors and the element substrate. This flexible substrate replaces the complex wiring configuration that would otherwise be needed on the underside, maintaining electrical connectivity while simplifying the overall device structure.
3Length of stationary object
If the circuit substrate is arranged in a brought-down state, then the height of the liquid ejection head is reduced, but the connection of wiring members to connectors becomes difficult
Solution Approach 1:
The patent incorporates the connectors on the top surface of the circuit substrate in advance, before the circuit substrate is brought down into its final position. This preliminary arrangement of connectors on the top surface allows for easy connection of wiring members while the circuit substrate is in its brought-down state, maintaining both compact height and ease of connection.
Data Source
AI summary
An object is to provide a liquid ejection head that can be mounted on a liquid ejection apparatus easily. The liquid ejection head comprises: a storing unit configured to store liquid; an element substrate having an ejection port surface in which an ejection port for ejecting liquid stored in the storing unit is formed; and an electrical circuit substrate electrically relaying a liquid ejection apparatus and the element substrate. In a posture in which the liquid ejection head is mounted on the liquid ejection apparatus, the electrical circuit substrate is located above the element substrate in the vertical direction, on the electrical circuit substrate, a connector for electrically connecting with an electrical connecting member comprised by the liquid ejection apparatus is provided, and on the electrical circuit substrate, the connector is provided only on a top surface facing in a direction opposite to the ejection port surface.