Liquid Ejection Head Wiring Layer Protection via Plated Metal Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional liquid ejection heads lack protection for the wiring layer of the circuit part, which can be damaged by strong wiping during cleaning, especially when ejecting diverse liquids such as metal ink or reagents.
Innovation Solution
A liquid ejection head design that includes a metal structure covering the wiring layer in regions not occupied by the nozzle member or electrodes, which is electrically independent and provides physical protection, formed through plating to ensure the wiring layer's integrity during strong wiping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If strong wiping is performed to clean the liquid ejection surface, then cleaning effectiveness is improved, but the wiring layer of the circuit part may be damaged
Solution Approach 1:
A metal structure is formed in advance over the wiring layer before the wiping process. This preliminary protective structure prevents direct contact between the wiper and the wiring layer, allowing strong wiping to be performed without damaging the underlying wiring layer.
Solution Approach 2:
The metal structure acts as an intermediary protective layer between the wiper and the wiring layer. It absorbs the mechanical stress of strong wiping while electrically isolating the wiring layer, thus protecting it from damage during the cleaning process.
2Reliability
If a metal structure is added to protect the wiring layer, then wiring layer protection is improved, but device complexity increases
Solution Approach 1:
The protective metal structure is merged with the existing circuit board structure. It is formed as an integrated part of the circuit board using the same plating process, combining the protective function with the existing manufacturing流程 without adding separate components.
Solution Approach 2:
The metal structure serves multiple functions simultaneously: it provides mechanical protection to the wiring layer, acts as an electrical shield, and can serve as a grounding path. This multi-functionality reduces the need for additional separate protective components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal structure effectively protects the wiring layer from damage during wiping, maintaining the functionality and quality of the liquid ejection head even under strong wiping conditions.
Implementation Method 1
a metal structure provided to cover the wiring layer in a region where neither the nozzle member nor the electrode is provided in the substrate, and the metal structure is electrically independent of the terminal part
Data Source
AI summary
A liquid ejection head includes a substrate; an energy generating member provided on the substrate to generate energy for liquid ejection; a terminal part provided on the substrate to be electrically connected with an outside, the terminal part including at least an electrode for supplying electric power to the energy generating member; a wiring layer provided on the substrate to electrically couple the energy generating member and the electrode; a nozzle member provided on the substrate, the nozzle member including a liquid ejection port and a liquid flow path, the liquid ejection port being arranged to correspond to the energy generating member, and the liquid flow path communicating with the liquid ejection port; and a metal structure provided to cover the wiring layer in a region where neither the nozzle member nor the electrode is provided, and the metal structure is electrically independent of the terminal part.