Ejection Device Pulse Correction for Liquid Application Consistency
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor packaging, particularly during the underfill step, the viscosity of liquid materials changes over time, leading to variations in ejection amounts, which complicates the application process and requires complex parameter calculations, affecting productivity and accuracy.
Innovation Solution
A method and apparatus that corrects ejection amounts by adjusting the frequency of a pulse signal, allowing for precise control of ejection pulses and pause pulses to maintain consistent application without altering the application length or speed, thereby simplifying the process and reducing errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the ejection is performed for a long time to apply the liquid material, then the application amount increases, but the viscosity of the liquid material changes over time causing variation in ejection amount
Solution Approach 1:
The patent applies periodic pulsing action to eject the liquid material. Instead of continuous ejection, the system uses periodic pulses with controlled duration and frequency to deposit material in discrete amounts, preventing viscosity changes from affecting overall ejection consistency. Each pulse is independent and can be precisely controlled to deliver a consistent amount of material regardless of time-dependent viscosity variations.
Solution Approach 2:
The patent dynamically adjusts ejection parameters based on real-time feedback. The system monitors ejection characteristics and dynamically modifies pulse duration, frequency, or amplitude to compensate for viscosity changes over time, maintaining consistent ejection amounts throughout the application process.
2Manufacturing precision
If complex parameters are calculated to correct ejection amount, then ejection precision improves, but device complexity and operation difficulty increase
Solution Approach 1:
The system performs self-correction through automated feedback mechanisms. Rather than requiring complex manual calculations or external intervention, the system automatically monitors ejection parameters and adjusts itself to maintain precision, reducing operational complexity while preserving accuracy.
Solution Approach 2:
The patent implements feedback control where ejection parameters are continuously monitored and adjusted based on actual performance. This automated feedback loop replaces complex manual parameter calculations with real-time adaptive control, maintaining precision while simplifying operation.
3Object-generated harmful factors
If the ejection unit moves upward or continues movement after ejection ends to prevent threading, then threading is reduced, but variation in applied liquid amount increases due to thread cutting effects
Solution Approach 1:
The patent uses periodic pulsing to create distinct, separated ejection events. Each pulse generates a discrete droplet or thread that is clearly defined in time and space, making thread management more predictable and reducing the harmful effects of threading during the upward movement phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables consistent application patterns without the need for complex calculations, maintains productivity, and ensures accurate application of liquid materials regardless of viscosity changes, reducing variations and improving quality.
Implementation Method 1
a resin 104 as the liquid material is filled into a gap between a semiconductor chip 101 and a substrate 102 by utilizing a capillary phenomenon
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Object: Provided are a method for applying a liquid material wherein there is no need to compute complex parameters and there is no influence on the speed of movement of an ejection unit, a device for the same, and a program for the same. Solving Means: An application method in which the liquid material is ejected from a nozzle while the nozzle and a workpiece are moved relative to each other and the liquid material is applied in a specific application amount to the workpiece, the application method including an initial parameter setting step of specifying, as a total pulse number, the number of times both ejection pulse signals and pause pulse signals are sent, specifying the number of ejection pulse signals in the total pulse number, which is needed to achieve the specific application amount, and specifying the remainder of the total pulse number as the pause pulse signals; a correction amount calculation step of measuring, per preset correction period, an ejection amount from the nozzle at the timing of the correction period, and calculating a correction amount for the ejection amount; and an ejection amount correction step of adjusting the number of ejection pulse signals and the number of pause pulse signals on the basis of the correction amount calculated in the correction amount calculation step. A device for the application method and a program for the application method.