Ejection Device Spacer for Plate Thickness Adaptation
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Solution Overview
Problem
Ejection devices for plate production systems often result in plates with varying thicknesses due to different material volumes, leading to potential damage during ejection as they may either be pressed under excessive pressure or fall due to air gaps, compromising the production process.
Innovation Solution
An ejection device with a height-adjustable spacer that displaces the carrier plate based on the plate's thickness, ensuring gentle ejection by maintaining a controlled distance between the plate and the carrier plate, thereby preventing damage and optimizing the ejection process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed stamp is used to eject plates from the mold, then the ejection process is simple, but plates with varying thicknesses cannot be accommodated, leading to damage or excessive air gaps
Solution Approach 1:
The carrier plate is made movable in the ejection direction, allowing its position to be dynamically adjusted according to the actual plate thickness. This dynamic adjustment capability enables the system to adapt to varying plate thicknesses without requiring a completely complex reconfiguration of the ejection device.
Solution Approach 2:
A spacer is introduced as an intermediary element between the stamp and the carrier plate. The spacer acts as a mediator that transmits the ejection force while maintaining a controlled distance, allowing the carrier plate to be positioned at the correct height for plates of different thicknesses.
2Productivity
If the carrier plate is positioned close to the mold, then ejection efficiency is high, but plates may fall due to excessive air gaps causing damage
Solution Approach 1:
The spacer serves as a mediator that ensures the carrier plate is positioned at the optimal distance from the mold. This controlled positioning prevents excessive air gaps that would cause plates to fall, while maintaining close proximity for efficient ejection.
Solution Approach 2:
The position of the carrier plate is adjusted as a variable parameter based on the actual plate thickness. By changing the carrier plate's position parameter dynamically, the system maintains optimal ejection conditions for each individual plate, preventing damage while ensuring efficiency.
3Reliability
If the carrier plate is positioned far from the mold, then plates are protected from falling, but ejection efficiency decreases due to excessive distance
Solution Approach 1:
The carrier plate's position is dynamically adjusted to be as close to the mold as possible while still maintaining sufficient distance to prevent plate falling. This dynamic optimization balances stability and efficiency for each ejection operation.
Solution Approach 2:
The spacer acts as a mediator that enables the carrier plate to be positioned at the precise optimal distance - close enough for efficient ejection but far enough to prevent plates from falling due to air gaps.
4Adaptability or versatility
If material volume varies, then production flexibility is maintained, but plate thickness varies causing ejection problems
Solution Approach 1:
The carrier plate position is dynamically adjusted based on the actual plate thickness resulting from varying material volumes. This dynamic positioning compensates for thickness variations, allowing flexible material dosing while maintaining consistent ejection quality.
Solution Approach 2:
The system uses feedback from the actual plate thickness to adjust the carrier plate position. By measuring or detecting the plate thickness and相应地 adjusting the carrier plate position, the system maintains proper ejection conditions despite variations in material volume.
Data Source
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AI summary
A device (107) for dispensing plates (4) comprising a mold (12) suitable and designed to receive a plate (4), and an ejection device (5, 9) for pushing the plate (4) out of the mold (12), wherein the ejection device (5, 9) has a punch movable in a predetermined displacement direction (6), and a carrier plate (7) for receiving the plate (4) ejected from the mold (12). According to the invention, the device (107) has a spacer (8) which, taking into account a thickness (d) of the plate (4), displaces the carrier plate in the displacement direction (6) and/or allows displacement of the carrier plate in the displacement direction (6) only up to a predetermined position.