Liquid Ejection Substrate Bonding Structure for Crosstalk Damping
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Solution Overview
Problem
The risk of substrate delamination occurs when the adhesiveness between a flexible member and bonding members is low in liquid ejection substrates, which are used in devices like inkjet heads, due to the propagation of pressure changes causing crosstalk between pressure chambers.
Innovation Solution
A liquid ejection substrate design that includes a support substrate with a depressed portion, a flexible member disposed between the channel and the depressed portion, and bonding members in partial contact, with the second bonding member having higher adhesive force to the first bonding member than to the flexible member, enhancing bonding strength and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible member is held between substrates using bonding members, then the flexible member can function as a damper to reduce crosstalk, but substrate delamination may occur when adhesiveness between the flexible member and bonding members is low
Solution Approach 1:
The patent introduces a bonding member as an intermediary element between the flexible member and the substrate. This bonding member has higher adhesive force to the flexible member than to the substrate, creating a controlled bonding hierarchy that prevents delamination while maintaining the damper function. The bonding member acts as a mediator that transfers mechanical stresses without causing substrate separation.
Solution Approach 2:
The patent changes the adhesive force parameter by making the bonding member's adhesive force to the flexible member greater than its adhesive force to the substrate. This parameter differentiation ensures that under stress, the bonding member maintains stronger attachment to the flexible member, preventing the flexible member from delaminating from the substrate while still allowing it to function as a damper.
2Stability of the object's composition
If the adhesive force between bonding members and flexible member is increased, then substrate delamination is suppressed, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by differentiating the adhesive force characteristics of the bonding member in different locations. The bonding member has higher adhesive force to the flexible member at the interface where delamination is most likely to occur, while maintaining simpler bonding characteristics elsewhere. This localized differentiation of adhesive properties provides targeted delamination prevention without requiring complex bonding configurations throughout the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses substrate delamination and improves bonding strength, ensuring stable ejection operations by damping pressure changes and reducing crosstalk effects.
Implementation Method 1
a flexible member (101) functioning as a damper
Implementation Method 2
the adhesiveness between the flexible member and the bonding members
Data Source
AI summary
A liquid ejection substrate including a lamination of a support substrate, a first bonding member, a flexible member having a sheet-like shape, a second bonding member, and a channel substrate having a channel through which a liquid is guided to a nozzle, in which the support substrate has a depressed portion at a position corresponding to at least a part of the channel provided to the channel substrate, and the flexible member is disposed between the channel and the depressed portion, and the first bonding member and the second bonding member are in partial contact with each other.