Liquid Ejection Head Substrate Heat Dissipation via Segmented Transfer

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Solution Overview

Problem

Existing technologies struggle to achieve sufficient heat dissipation in printing element substrates equipped with temperature adjustment heating elements and temperature detection elements, leading to inefficient thermal management.

Innovation Solution

A liquid ejection head substrate is designed with a base, a first heat transfer layer installed below the energy generating element, a temperature adjustment heating element, and a first heat transfer member connecting the heat transfer layer and the base. The heat transfer member is positioned between adjacent energy generating elements and between these elements and the heating element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If temperature adjustment heating elements and temperature detection elements are added to printing element substrates to improve functionality, then the functionality and temperature control capability are improved, but heat dissipation efficiency deteriorates due to additional heat sources and high-density arrangement

Engineering Contradiction:

ImprovefunctionalityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent divides the heat dissipation function into multiple segments by providing first heat transfer members between adjacent energy generating elements and second heat transfer members between energy generating elements and temperature adjustment heating elements. This segmented approach allows targeted heat transfer from different heat sources to respective heat dissipation paths, resolving the contradiction by enabling effective heat management despite multiple heat-generating components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces heat transfer members as intermediary components between heat-generating elements (energy generating elements and temperature adjustment heating elements) and the base. These intermediaries facilitate efficient heat transfer from multiple sources without requiring direct contact with the base, allowing functionality to be enhanced while maintaining heat dissipation efficiency through dedicated thermal pathways.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If members are arranged at high density on printing element substrates to increase the number of printing elements, then productivity is improved, but heat dissipation becomes more difficult due to reduced spacing and increased heat generation

Engineering Contradiction:

Improvenumber of printing elementsVSAvoidheat dissipation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent applies local quality by providing heat transfer members specifically at locations where heat dissipation is critical - between adjacent energy generating elements and between these elements and temperature adjustment heating elements. This localized heat transfer approach enables high-density arrangement of printing elements while maintaining effective heat dissipation at the hottest spots, resolving the contradiction between density and thermal management.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient heat dissipation in printing element substrates with temperature adjustment heating elements, improving thermal management and maintaining high printing quality.

Implementation Method 1

a first heat transfer layer configured to be installed below the energy generating element, and formed by being laminated on the base via an insulating layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first heat transfer member configured to connect the first heat transfer layer and the base, wherein the first heat transfer member is installed between adjacent ones of a plurality of the energy generating elements and between the energy generating element and the temperature adjustment heating element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a temperature adjustment heating element configured to be capable of adjusting the temperatures of the liquid and the liquid ejection head substrate

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20250100278A1Liquid ejection head substrate, liquid ejection head, and liquid ejection apparatus

Publication Date: 2025.03.27 CANON KK

AI summary

A technology capable of efficiently dissipating heat in a printing element substrate with a temperature adjustment heating element mounted thereon is to be provided. A liquid ejection head substrate capable of ejecting liquid using energy generated by an energy generating element includes: a base; a first heat transfer layer configured to be installed below the energy generating element, and formed by being laminated on the base via an insulating layer; a temperature adjustment heating element configured to be capable of adjusting the temperatures of the liquid and the liquid ejection head substrate; and a first heat transfer member configured to connect the first heat transfer layer and the base, wherein the first heat transfer member is installed between adjacent ones of a plurality of the energy generating elements and between the energy generating element and the temperature adjustment heating element.