Ejector Pump Plasma Abatement for Semiconductor Exhaust
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Solution Overview
Problem
Ejector pumps used in semiconductor manufacturing struggle with the residual presence of PFC gases, which require separate abatement processes, increasing the cost and complexity of exhaust systems.
Innovation Solution
A pumping arrangement that integrates an ejector pump with a backing pump and a plasma abatement device, where a plasma stream is used to decompose PFC gases within the ejector pump, converting them into stable, low molecular weight by-products that can be removed by a liquid ring pump, thereby eliminating the need for separate abatement tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a conventional ejector pump is used to pump PFC gases, then the gas can be transported, but the PFC gases require separate abatement processes which increase system complexity and cost
Solution Approach 1:
The patent combines the ejector pump with a plasma abatement device into a single integrated unit. The plasma device is positioned within the ejector pump housing, allowing simultaneous gas pumping and PFC abatement functions to be performed by one device rather than requiring separate pumping and abatement systems.
Solution Approach 2:
The integrated device performs multiple functions: it acts as both a vacuum pump for gas transport and a plasma abatement reactor for PFC decomposition. The ejector pump chamber serves dual purposes as both the pumping mechanism and the reaction chamber where plasma treatment occurs.
2Reliability
If separate abatement tools are added to treat residual PFC gases, then PFC decomposition can be achieved, but the cost and complexity of the exhaust system increases significantly
Solution Approach 1:
The plasma abatement device is integrated within the ejector pump housing, merging two previously separate systems into one compact unit. This eliminates the need for additional standalone abatement equipment while maintaining effective PFC decomposition capability.
3Reliability
If multiple pumping stages are used to handle both pumping and abatement, then gas treatment can be effective, but the number of components and capacity requirements increase
Solution Approach 1:
The integrated design allows the ejector pump to perform both pumping and abatement in a single stage, eliminating the need for multiple sequential pumping stages. The plasma device processes PFC gases during the pumping operation itself, improving overall system efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated solution reduces the number of pumping stages and capacity requirements, lowers operational costs by eliminating the need for conventional scrubbers, and efficiently converts PFC gases into manageable compounds, improving the efficiency and cost-effectiveness of gas treatment.
Implementation Method 1
a gas abatement device for ejecting a stream of plasma through a nozzle into the gas mixing portion of the chamber to provide a motive fluid for the pump and decompose a component of the gas stream
Implementation Method 2
an ejector pump comprises a chamber having a gas mixing portion and a diffuser portion, an inlet is for conveying a gas stream into the gas mixing portion
Data Source
AI summary
An ejector pump (100) includes a chamber having a gas mixing portion (108) and a diffuser portion (112). An inlet (10S) conveys a gas stream into the gas mixing portion, and an outlet (114) conveys the gas stream from the diffuser portion. To provide a motive fluid for the pump, a stream of plasma is ejected through a nozzle (116) into the gas mixing portion (108) of the chamber. Reactive species contained within the plasma stream react with a component of the gas stream to provide simultaneous pumping and abatement of the gas stream.