Electroluminescent Display Alignment via Guide Pins
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Solution Overview
Problem
Electroluminescent display devices face color mixture defects due to bonding defects during the alignment process, which negatively impact yield and performance.
Innovation Solution
The implementation of guide pins on the upper substrate and alignment holes on the lower substrate, allowing for self-alignment and improved bonding precision, thereby reducing color mixture defects and enhancing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding process is used without alignment features, then manufacturing process is simpler, but bonding precision deteriorates causing color mixture defects
Solution Approach 1:
Guide pins and alignment holes are introduced as intermediary alignment features between the lower substrate and upper substrate. These intermediaries establish precise relative positioning during bonding, preventing color mixture defects while maintaining a relatively simple overall structure.
Solution Approach 2:
The guide pins are pre-formed on the lower substrate before bonding to the upper substrate. This preliminary action ensures that alignment features are already in place to guide precise positioning during the bonding process, improving bonding precision without complicating the bonding step itself.
2Manufacturing precision
If alignment holes are formed by removing bank entirely, then alignment precision is improved, but manufacturing complexity increases
Solution Approach 1:
Instead of removing the entire bank structure, only partial regions of the bank are removed to form alignment holes at specific locations. This partial action provides sufficient alignment precision while preserving most of the bank structure for its light-emission partitioning function, thereby reducing manufacturing complexity.
Data Source
AI summary
An electroluminescent display device can include a lower substrate divided into an active area and a non-active area, a thin film transistor disposed above the lower substrate, a planarization layer disposed above the thin film transistor, a light emitting diode disposed above the planarization layer, a bank disposed on the planarization layer to partition an emission area, an upper substrate disposed opposite to the lower substrate, a filler filled in a space between the upper substrate and the light emitting diode, a dam structure enclosing the filler in the non-active area, a plurality of alignment holes disposed between the active area and the dam structure, and a plurality of guide pins provided in the upper substrate of the non-active area to be fitted into the plurality of alignment holes. By doing this, the color mixture defect due to the bonding defect can be suppressed or minimized.