Heat-Curable Adhesive Preheating for Organic EL Panel Sealing
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Solution Overview
Problem
Existing methods for sealing organic electroluminescent panels using heat-curable adhesives face challenges such as hygroscopic properties leading to poor control of moisture content, which affects sealing characteristics and durability, and require costly dehydration methods or limited application due to UV-curable adhesives needing transparent substrates.
Innovation Solution
A manufacturing method involving the formation of a heat-curable adhesive layer on a sealing substrate, preheating to a controlled moisture content and curing degree, and bonding the organic electroluminescent element in a controlled inert gas environment to maintain adhesion and prevent degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heat-curable adhesive is used for sealing organic EL panel, then ease of manufacture and handling convenience are improved, but moisture content control becomes difficult due to hygroscopic properties
Solution Approach 1:
The adhesive layer is preheated before bonding to remove moisture and prevent degradation, achieving dehydration treatment without requiring huge storage facilities or complex dehydration processes
Solution Approach 2:
The curing degree of the adhesive is controlled within 0-50% during preheating, and the adhesive layer is heated to 50-200°C to remove moisture while preventing complete curing that would lose adhesion function
2Ease of manufacture
If dehydration treatment is performed using simple heating method, then cost is reduced and process is simplified, but adhesive curing advances and adhesion function is lost
Solution Approach 1:
The adhesive layer is preheated to remove moisture before bonding, but the heating is controlled to keep curing degree below 50%, preserving adhesion function for subsequent bonding
Solution Approach 2:
The curing degree parameter is precisely controlled within 0-50% range during preheating, and heating temperature is maintained at 50-200°C, achieving moisture removal without complete curing
3Manufacturing precision
If UV-curable adhesive is used instead of heat-curable adhesive, then moisture content control is improved, but application range is limited due to requirement of transparent substrate
Solution Approach 1:
The curing method is changed from UV irradiation to controlled thermal curing with 0-50% curing degree control during preheating, enabling application on non-transparent substrates while maintaining moisture control
Solution Approach 2:
The bonding is performed in inert gas environment (nitrogen or rare gas) to prevent adhesive degradation and maintain low moisture content, replacing the need for UV transparency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves excellent sealing performance and durability for organic electroluminescent panels using heat-curable adhesives while minimizing long-term degradation and reducing costs associated with dehydration processes.
Implementation Method 1
a step of preheating the heat-curable adhesive layer formed on the sealing substrate
Implementation Method 2
preheating to a controlled moisture content
Implementation Method 3
a step of curing/heating the preheated heat-curable adhesive layer
Data Source
AI summary
A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order.