Organic EL Partition Wall Adhesion to Titanium Wiring
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Solution Overview
Problem
In organic electroluminescent (EL) display devices, the partition wall insulating film easily peels off due to poor adhesion to conductive films, particularly when made of organic resin, leading to contamination and poor display quality.
Innovation Solution
The use of an inorganic film as the partition wall, which adheres well to both the wiring and the organic resin film, preventing direct contact between the wiring and the organic resin film, and employing a layered structure with a silicon oxide, silicon nitride, or silicon oxynitride film as the second insulating layer to enhance adhesion and prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic resin is used for the partition wall, then the partition wall can be formed with low driving voltage and good flexibility, but the partition wall has poor adhesion to conductive films particularly titanium wiring causing peeling
Solution Approach 1:
The patent employs a composite structure consisting of an organic resin partition wall combined with an inorganic insulating film layer. This composite approach allows the organic resin to provide flexibility and low driving voltage characteristics while the inorganic film layer provides strong adhesion to the titanium wiring, thereby resolving the adhesion problem without sacrificing the advantages of organic materials.
Solution Approach 2:
The inorganic insulating film acts as an intermediary layer between the titanium wiring and the organic resin partition wall. This intermediate layer improves interfacial adhesion and prevents direct contact between the organic resin and metal wiring, thereby preventing peeling while maintaining the electrical insulation and structural integrity required for device operation.
2Adaptability or versatility
If opening is provided in the sealing region, then multiple sections can be formed for wiring and partition wall alignment, but the end portion of the partition wall becomes thin and easily peels or gets cut off during baking
Solution Approach 1:
The patent uses a composite structure of organic resin and inorganic insulating film to reinforce the partition wall at the opening section. The inorganic film provides structural support to the thinned organic resin portion, preventing it from peeling or being cut off during the baking process while still allowing multiple alignment sections to be formed.
Solution Approach 2:
The inorganic insulating film is formed beforehand to provide structural reinforcement to the organic resin partition wall before the opening is created and before the baking process occurs. This pre-reinforcement prevents the partition wall from becoming too thin and脆弱 at the opening sections, cushioning against potential damage during subsequent processing steps.
3Reliability
If the partition wall end portion overlaps with the step portion of the wiring, then adhesion is improved, but the partition wall may be cut off or peeled during baking due to contraction
Solution Approach 1:
The patent employs a composite structure where the inorganic insulating film provides structural stability to the organic resin partition wall. This composite approach allows the partition wall to overlap with the wiring step portion for good adhesion while the inorganic film prevents the organic resin from being cut off or peeled during baking-induced contraction.
Solution Approach 2:
The inorganic insulating film is formed in advance to provide structural support to the organic resin partition wall before the baking process occurs. This pre-reinforcement cushions against the contraction forces generated during baking, preventing the partition wall from being cut off or peeled even when it overlaps with the wiring step portion.
Data Source
AI summary
It is an object of the present invention to prevent an insulating film from peeling in a section where the insulating film is adjacent to a sealing region. Over a first substrate 104, a pixel portion 100 provided with a light emitting element, a source driver 101, a gate driver 102, and a sealing region 103 are provided. A light emitting element is sealed between the first substrate 104 and a second substrate 110 by a sealant 108. An insulating film 107 serves as a partition wall of the light emitting element. An end portion of the insulating film 107 which is adjacent to the sealing region 103 does not overlap with a step formed by a side surface and an upper surface of a conductive film 106 which serves as a wiring.