Organic EL Power Supply Line Layout for Luminance Uniformity
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Solution Overview
Problem
Active matrix organic EL display panels face issues with high wiring resistance in drive power supply lines, leading to luminance differences and heat generation, which can cause inter-layer short circuits and reduce yield due to the need for wide wiring patterns that increase the cross area and parasitic capacitance.
Innovation Solution
The proposed solution involves specific layout patterns for the high-potential and low-potential power supply lines that avoid crossing with the drive power supply line, minimizing the risk of inter-layer short circuits and optimizing the wiring configuration to reduce parasitic capacitance and improve manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the drive power supply line is made wide to reduce wiring resistance, then luminance uniformity is improved, but the cross area increases and parasitic capacitance increases
Solution Approach 1:
The patent introduces a third dimension (Z-axis) by stacking power supply lines across multiple layers. The drive power supply line is configured to extend across the display panel thickness, utilizing multiple conductive layers to provide parallel current paths, thereby reducing in-plane wiring resistance without increasing the cross-sectional area.
Solution Approach 2:
The drive power supply line is segmented into multiple sections across different conductive layers. Each layer contains a portion of the power supply path, and these segments are electrically connected through vertical conductors, distributing the current flow across multiple pathways to reduce overall resistance without requiring any single layer to have excessive width.
2Manufacturing precision
If the drive power supply line is made wide to reduce wiring resistance, then luminance uniformity is improved, but heat generation increases causing inter-layer short circuits
Solution Approach 1:
The power supply path is divided into multiple segments across different conductive layers, with each segment carrying a portion of the total current. This segmentation distributes heat generation across multiple locations and reduces the current density in any single wiring segment, thereby lowering overall heat accumulation and reducing the risk of thermal-induced short circuits.
Solution Approach 2:
By transitioning from a two-dimensional in-plane wiring approach to a three-dimensional multi-layer configuration, the patent disperses heat generation across the vertical dimension. The multiple conductive layers act as separate heat dissipation pathways, preventing localized heat concentration that would occur in wide single-layer wiring.
3Productivity
If wide wiring patterns are used to reduce wiring resistance, then manufacturing yield is improved, but parasitic capacitance increases
Solution Approach 1:
The patent utilizes the vertical dimension by implementing the drive power supply line across multiple conductive layers stacked in the Z-direction. This multi-layer approach provides parallel current pathways that reduce effective resistance without requiring increased in-plane wiring width, thereby maintaining lower parasitic capacitance while achieving the same current-carrying capacity.
Data Source
AI summary
Disclosed herein is an electroluminescence display panel including a pixel circuit, a signal line, a scan line, a drive power supply line, a common power supply line, a power supply line drive circuit, a high-potential power supply line, and a low-potential power supply line.