Elastic Buffer Pad for Semiconductor Chip Stacking
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Solution Overview
Problem
When stacking multiple layers of semiconductor chips, the lower layer often experiences lateral slipping and damage due to inadequate support, leading to breakage during the stacking process.
Innovation Solution
The use of an apparatus with a chuck and vacuum part, featuring a porous plate and an elastic buffer pad, which provides a secure and flexible surface for chip placement, preventing slipping and facilitating precise alignment and bonding between chip layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If chips are stacked in multiple layers for compact packages, then package density is improved, but the lower layer chips experience lateral slipping and damage
Solution Approach 1:
A buffer pad is placed on the chuck surface before loading chips to provide cushioning support. The buffer pad prevents lateral slipping and damage to lower layer chips during the stacking process by absorbing mechanical stresses and providing a compliant interface between the rigid chuck and the chip layers.
Solution Approach 2:
The buffer pad is made of an elastic material that provides flexibility to the chuck surface. This flexible layer adapts to the chip geometry and provides uniform support, preventing lateral movement while maintaining the vacuum holding force. The elastic material allows the surface to conform to the chip shape without rigid contact points that could cause slipping.
2Strength
If a rigid plate is used on the chuck, then structural strength is improved, but chip alignment precision deteriorates due to lateral slipping
Solution Approach 1:
The chuck structure uses a composite configuration with a rigid plate base and an elastic buffer pad surface layer. The rigid plate provides overall structural strength and vacuum holding capability, while the elastic buffer pad surface layer provides compliance for precise chip alignment and prevents lateral slipping during positioning and stacking operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents lateral slipping and damage during chip stacking, ensuring reliable bonding and alignment, thus enhancing the manufacturing process for compact semiconductor packages.
Implementation Method 1
The vacuum part generates a vacuum so that the plurality of chips are sucked onto the buffer pad
Implementation Method 2
The buffer pad is formed of an elastic material having elasticity greater than the plate
Data Source
AI summary
Apparatuses of manufacturing semiconductor packages are provided. An apparatus includes a chuck having a body, a porous plate disposed on the body, and a buffer pad disposed on the plate to provide a place on which a plurality of chips are loaded. The buffer pad has elasticity greater than the plate. The apparatus also includes a vacuum part supplying vacuum to the chuck so that the plurality of chips are sucked onto the buffer pad. Methods of manufacturing semiconductor packages using the apparatus are also provided.