Elastic-Top Lamination Chuck for Smoother Semiconductor Packaging

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The integration of multiple semiconductor devices into compact, high-performance packages poses challenges in miniaturization and electrical performance, particularly in achieving lower transmission and insertion losses, which existing packaging and assembling techniques have not adequately addressed.

Innovation Solution

A lamination chuck with a soft, elastic polymeric top layer and a rigid support layer, featuring vacuum channels for precise film material handling and lamination, ensures smooth surface quality and efficient integration of semiconductor packages by applying controlled suction and pressure during the lamination process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If traditional packaging and assembling techniques are used, then manufacturing simplicity is maintained, but transmission loss and insertion loss cannot be sufficiently reduced

Engineering Contradiction:

Improvetransmission loss and insertion lossVSAvoidpackaging and assembling techniques

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent segments the semiconductor device structure into multiple functional layers including substrate, device layers, and encapsulant layers. Each layer is separately manufactured and then laminated together, allowing optimization of each layer's properties to reduce transmission and insertion losses while maintaining manageable manufacturing complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs composite material structures combining different dielectric materials, conductive layers, and encapsulant materials with optimized properties. This composite approach enables tailored electromagnetic performance to reduce losses while the modular lamination process keeps manufacturing feasible

Inventive Principle:

Principle #40Composite materials

2Volume of moving object

If semiconductor devices are miniaturized to meet increasing demand, then higher integration is achieved, but surface irregularities and manufacturing precision challenges increase

Engineering Contradiction:

Improvesemiconductor package sizeVSAvoidsurface smoothness

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies local quality optimization by using a compliant encapsulant material that specifically targets and fills surface irregularities in localized areas. The encapsulant's modified rheological properties enable it to flow into and smooth over uneven surfaces beneath, achieving local surface correction without requiring complete re-manufacturing of the entire device

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the rheological parameters of the encapsulant material, specifically adjusting viscosity and flow characteristics, to enable the material to effectively fill and smooth surface irregularities. This parameter modification allows the encapsulant to adapt to varying surface conditions while maintaining miniaturization benefits

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables the production of semiconductor packages with improved surface smoothness and reduced irregularities, enhancing electrical performance and miniaturization capabilities while maintaining cost-effectiveness and yield.

Implementation Method 1

Methodology Applied

Scientific EffectVacuum suction: Vacuum

Implementation Method 2

The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS11993066B2Chuck, lamination process, and manufacturing method of semiconductor package using the same

Publication Date: 2024.05.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.