Elastic Chuck Sealing for Warped Substrate Rotation
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Solution Overview
Problem
Existing substrate processing apparatuses face issues with maintaining sufficient suction force during rotation, particularly for warped substrates, leading to peeling and suction errors during development processing.
Innovation Solution
A substrate processing apparatus and method that incorporates a chuck body with a suction region and an annular elastic part made of an elastic material, which deforms to follow and hold the substrate's lower surface center, ensuring stable suction even with warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the substrate is rotated with low suction force, then the rotation speed can be increased for faster processing, but the substrate peels off from the sucking/holding part
Solution Approach 1:
The invention introduces an annular elastic part (a flexible element) that projects upward from the spinning base to surround the suction region. This elastic part deforms to follow the lower surface of the substrate, maintaining close contact even when the substrate is warped. By using this flexible component, the system can hold the substrate reliably at higher rotation speeds without peeling, as the elastic part adapts to substrate irregularities while maintaining suction force.
Solution Approach 2:
The invention adds a vertical dimension to the suction mechanism by having the annular elastic part project upward from the spinning base. This three-dimensional configuration allows the elastic part to contact and follow the substrate's lower surface, creating additional contact points and suction paths. This dimensional addition enhances the holding reliability without restricting rotation speed, as the suction force is distributed across multiple contact points along the elastic part's height.
2Adaptability or versatility
If the substrate is warped, then the suction region cannot follow the substrate surface, but using a rigid chuck body cannot adapt to the warpage
Solution Approach 1:
The annular elastic part is made of an elastic material that can deform and flex to match the contours of the substrate's lower surface. When the substrate is warped, the elastic part bends and follows the surface irregularities, maintaining continuous contact around the suction region. This flexibility allows the system to adapt to various degrees of warpage while preserving reliable suction contact, eliminating the peeling problem associated with rigid chucks.
Solution Approach 2:
The invention changes the physical state of the chuck body's peripheral component from rigid to elastic. By using an elastic material for the annular part, the system can dynamically adjust its shape and position in response to substrate warpage. This parameter change (from rigid to flexible) enables the chuck to conform to the substrate's lower surface, maintaining effective suction contact even when the substrate geometry deviates from flat.
3Reliability
If the suction force is increased to prevent peeling, then the substrate holding is more reliable, but the suction force may damage the substrate or cause deformation
Solution Approach 1:
The annular elastic part distributes the suction force across its flexible structure, allowing it to conform to the substrate's lower surface. This distribution of suction force through a flexible medium prevents concentration of stress at specific points, reducing the risk of substrate damage or deformation. The elastic part acts as a cushion that maintains reliable holding while protecting the substrate from excessive or localized suction forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively maintains suction force to withstand rotation of warped substrates, preventing peeling and suction errors during the development processing, ensuring stable and efficient processing.
Implementation Method 1
a chuck body having an upper surface with a suction region configured to suction and hold a lower surface center of a substrate
Implementation Method 2
an annular elastic part made of an elastic material and formed from the externally fitting part to project further upward than the upper surface of the chuck body and surround the suction region, and the annular elastic part is configured to deformed to follow and hold in close contact with a lower surface of the substrate
Data Source
AI summary
In the substrate processing apparatus and method according to the present invention, a suction region of a chuck body is surrounded by the annular elastic part of a packing. Before a lower surface center of a substrate and the suction region of the chuck body are held in close contact, the annular elastic part is deformed to follow and held in close contact with a lower surface of the substrate while surrounding the lower surface center of the substrate. Thus, suction leak hardly occurs, and the substrate is sucked and held by the suction region not only when the substrate is not warped, but also when the substrate is warped. Thus, the substrate can be processed with a processing liquid while being sucked and held with a suction force capable of sufficiently withstanding the rotation of the substrate.