Elastic Conductive Wires for Flexible Semiconductor Packages
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Solution Overview
Problem
Flexible semiconductor packages face issues with conductive wire separation from bonding pads when bent or twisted, due to tensile stresses, compromising the integrity of the conductive wire and electrical connections.
Innovation Solution
Incorporating elastic conductive wires with coil spring or sinusoidal configurations, which are geometrically configured to be flexible, extendable, and collapsible, and optionally covered with an insulation film, to maintain connectivity between semiconductor chips during bending or twisting of the flexible substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional rigid conductive wires are used in flexible semiconductor packages, then the electrical connection is stable, but the conductive wire separates from bonding pads when the package is bent or twisted
Solution Approach 1:
The conductive wire is transformed from a rigid structure to a dynamic structure with elastic portions that can deform. The elastic portions allow the wire to dynamically adapt its shape during bending or twisting of the flexible substrate, maintaining electrical connection while accommodating mechanical stress.
Solution Approach 2:
The conductive wire incorporates elastic portions that function as flexible elements. These elastic portions can be geometrically configured (e.g., sinusoidal patterns) to provide flexibility while maintaining electrical conductivity, allowing the wire to bend without breaking or separating from bonding pads.
2Adaptability or versatility
If elastic conductive wires with coil spring or sinusoidal configurations are used, then the flexibility and bendability are improved, but the device complexity increases
Solution Approach 1:
The elastic portions are created by changing the geometric parameters of the conductive wire, such as forming sinusoidal patterns or coil spring configurations. These parameter changes transform a simple straight wire into a flexible structure without requiring additional materials or complex assembly processes.
Solution Approach 2:
The conductive wire incorporates curved geometric configurations such as sinusoidal patterns or coil spring shapes. These curved forms provide elasticity and flexibility, allowing the wire to deform during bending while maintaining structural integrity and electrical connection.
3Reliability
If the conductive wire is made more flexible with elastic portions, then the separation from bonding pads is prevented, but the risk of accidental electrical connections increases
Solution Approach 1:
An insulation film is applied to the conductive wire to provide electrical isolation. This insulation layer prevents accidental electrical connections between adjacent wires or to the substrate, while the elastic portions of the wire maintain mechanical flexibility and connection integrity during bending.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastic conductive wires effectively prevent separation from bonding pads, ensuring reliable electrical connections even when the flexible semiconductor package is bent or twisted, and can be designed to reduce length and prevent accidental electrical connections.
Implementation Method 1
each conductive wire has at least one elastic portion... geometrically configured to be flexible by being bendable, extendable, and collapsible
Data Source
AI summary
A flexible semiconductor package apparatus having a responsive bendable conductive wire member is presented. The apparatus includes a flexible substrate, semiconductor chips, and conductive wires. The semiconductor chips are disposed on the flexible substrate and spaced apart from each other on the flexible substrate. Each semiconductor chip has bonding pads. The conductive wires are electrically connected to the bonding pads of the semiconductor chip. Each conductive wire has at least one elastic portion. One preferred configuration is that part of the conductive wire is wound to form a coil spring shape so that the coil spring shape of the conductive wire aid in preventing the conductive wire from being separated from the corresponding bonding pad of the semiconductor chip when the flexible substrate on which the semiconductor chips are mounted are bent, expanded or twisted.