Elastic Vertical Conductor Structure for Thermal-Stress Relief
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Solution Overview
Problem
Existing electronic components face damage from thermal stress due to rigid electrical connections between the circuit board and components, which crack under differential thermal expansion.
Innovation Solution
The use of vertical conductors embedded in an elastic material within an electronic component, allowing flexibility and movement to accommodate thermal expansion, thereby maintaining electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid electrical connections are used between the circuit board and electronic component, then electrical connection stability is improved, but the connections are damaged by thermal stress from differential thermal expansion
Solution Approach 1:
The patent applies this principle by using an elastomeric layer (flexible material) to replace rigid connection structures. The elastomeric layer can deform elastically under thermal stress, absorbing expansion forces while maintaining electrical connectivity through conductive elements embedded within it, thus preventing connection damage from differential thermal expansion.
Solution Approach 2:
The patent changes the mechanical properties of the connection structure by transitioning from rigid materials to elastomeric materials with specific durometer values (Shore A 20-80). This parameter change enables the connection structure to exhibit elastic deformation characteristics, allowing it to accommodate thermal expansion while maintaining reliability.
2Object-affected harmful factors
If flexible connections are used to accommodate thermal expansion, then resistance to thermal stress is improved, but connection strength may be reduced
Solution Approach 1:
The patent employs composite materials by combining elastomeric material with conductive elements (such as metal traces, wires, or particles) within the elastomeric matrix. This composite structure provides both the flexibility needed for thermal expansion accommodation and the electrical conductivity and mechanical strength required for reliable connections.
Solution Approach 2:
The patent utilizes the elastic curvature and deformability of the elastomeric layer to absorb thermal stress. The elastomeric material's ability to curve and deform elastically allows it to withstand repeated expansion and contraction cycles without failing, maintaining both flexibility and strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the risk of damage to electrical connections by enabling them to move and adapt to thermal stress, ensuring consistent contact despite differing thermal expansion rates between the component and circuit board.
Implementation Method 1
The component comprises one or more vertical electrical conductors which are embedded in an elastic material
Data Source
Figure 1~3a
Figure 3b~4a
Figure 4b~4c
AI summary
An electronic component comprising a substrate and a packaging layer on a first side of the substrate. The component also comprises at least one vertical electrical conductor embedded in a layer of elastic material, so that the layer of elastic material lies between the at least one vertical electrical conductor and the packaging layer.