Camera Module With Elastic Connection for Low-Noise Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing voice coil motor (VCM) technology is difficult to apply to subminiature, low-power camera modules, particularly in miniaturized cameras for smartphones, requiring improved assembly processes and reduced image noise.
Innovation Solution
A camera module design that integrates an image sensor with a connecting board and a second circuit board, utilizing a connective elastic member and support member to simplify assembly, reduce soldering points, and inhibit image noise, while enabling autofocusing and handshake correction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional VCM assembly process is used, then camera module functionality is achieved, but assembly complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the image sensor mounting board and the circuit board into a single integrated board structure. The image sensor is directly mounted on this integrated board, which also carries the circuit traces and connections. This merging eliminates the need for separate mounting steps and reduces the number of components, thereby simplifying the assembly process while maintaining camera functionality.
Solution Approach 2:
The integrated board serves multiple functions simultaneously: it acts as the mounting substrate for the image sensor, provides electrical connections through circuit traces, and serves as a structural support element. This multi-functionality reduces the overall component count and simplifies manufacturing compared to traditional separate VCM assemblies.
2Reliability
If multiple soldering points are used to connect image sensor, then reliable electrical connection is achieved, but image noise increases and reliability decreases
Solution Approach 1:
The patent extracts and eliminates unnecessary soldering points from the traditional assembly. By integrating the image sensor mounting directly onto the circuit board with optimized connection paths, the design reduces the number of solder joints required. This extraction of redundant connections decreases sources of noise and potential failure points, thereby improving both reliability and image quality.
3Volume of moving object
If camera module is miniaturized, then smartphone integration is improved, but assembly precision and alignment become more difficult
Solution Approach 1:
By merging the image sensor mounting board with the circuit board into a single integrated structure, the patent reduces the overall number of components that need to be aligned during assembly. This integration maintains compact dimensions while simplifying the alignment requirements, as fewer separate parts need to be precisely positioned relative to each other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies assembly, reduces material and manufacturing costs, and suppresses image noise by minimizing soldering points and components, enhancing alignment and performance in miniaturized camera modules.
Implementation Method 1
a connective elastic member including a first coupler disposed on the holder and coupled to the first terminal, a second coupler coupled to a remaining end of the support member, and a connector connecting the first coupler to the second coupler
Implementation Method 2
The image sensor may be shifted or tilted in a direction perpendicular to an optical axis by virtue of interaction between the magnet and the coil
Data Source
AI summary
An embodiment may comprise: a housing; a first circuit board disposed in the housing; a magnet disposed in the housing; a holder spaced apart from the housing; a second circuit board coupled to the holder; a coil disposed on the second circuit board and corresponding to the magnet; a connection substrate comprising a first terminal; an image sensor disposed on the connection substrate; a support member having one end coupled to the first circuit board; and an elastic connection member comprising a first coupling part disposed in the holder and coupled to the first terminal, a second coupling part coupled to the other end of the support member, and a connection part for connecting the first coupling part and the second coupling part.