Elastic Contact Element for Photovoltaic Module Encapsulation
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Solution Overview
Problem
Photovoltaic modules and other electronic devices face high costs and durability issues due to encapsulation methods, which can lead to cracks and loss of electrical contact under temperature variations and surface irregularities.
Innovation Solution
Incorporating elastic materials between the encapsulating layers and electrical contact elements to apply pressure and compensate for stress variations, ensuring reliable electrical contact and durability across temperature cycles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photovoltaic cells are encapsulated between two glass substrates with a peripheral seal to reduce encapsulation cost, then manufacturing cost is reduced, but the cells crack after thermal cycling due to stress from pressure variations
Solution Approach 1:
The patent changes the physical state and mechanical properties of the encapsulation material by using a viscoelastic polymer instead of rigid glass sealing. This material can deform and flow under thermal stress, accommodating pressure variations without transferring damaging stresses to the photovoltaic cells, thereby preventing crack formation while maintaining the simplified encapsulation structure
Solution Approach 2:
The patent employs a composite encapsulation structure where a viscoelastic polymer material is used to create the seal between glass substrates. This composite approach combines the transparency and rigidity of glass with the stress-absorbing properties of the viscoelastic polymer, allowing the assembly to withstand thermal cycling without cell damage
2Device complexity
If surface irregularities in glass substrates are high to reduce manufacturing complexity, then manufacturing is simpler, but electrical contact with photovoltaic cells is compromised
Solution Approach 1:
The patent changes the mechanical compliance parameter of the encapsulation material by selecting a viscoelastic polymer with appropriate viscosity and elasticity characteristics. This material can deform to conform to surface irregularities, ensuring continuous electrical contact between the photovoltaic cells and the encapsulation structure even when substrate surfaces are not perfectly flat
Solution Approach 2:
The viscoelastic polymer acts as an intermediary layer between the glass substrates and the photovoltaic cells. This intermediate material compensates for surface irregularities through its deformability, maintaining reliable electrical contact without requiring high-precision substrate manufacturing
3Strength
If rigid encapsulation is used to provide structural stability, then mechanical strength is improved, but stress from temperature variations causes cell cracking
Solution Approach 1:
The patent changes the temperature-dependent mechanical parameters of the encapsulation material by using a viscoelastic polymer whose viscosity and elasticity vary with temperature. This allows the material to maintain structural stability at operating temperatures while becoming more compliant under thermal stress, preventing crack propagation in the photovoltaic cells
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of elastic materials between encapsulating layers and electrical contact elements reduces the cost of encapsulation, prevents cracks, and maintains electrical contact integrity despite temperature variations and surface irregularities, enhancing the durability and efficiency of photovoltaic modules and similar devices.
Implementation Method 1
an element based on at least one elastic material placed between one of the two layers of material and the electrical contact element
Data Source
AI summary
An electrical and/or electronic device including: an electrical and/or electronic component; two layers of material forming front and back faces of the device and between which the electrical and/or electronic component is encapsulated, the component including at least two opposite faces placed facing the two layers of material; an electrical contact element placed in contact with one of the faces of the electrical and/or electronic component; an element based on at least one elastic material placed between one of the two layers of material and the electrical contact element, forming a first layer of elastic material covering the one of the two layers of material; and a second layer based on at least one elastic material with an elastic stiffness less than the stiffness of the elastic material in the first layer, placed in contact with the first layer of elastic material.