Elastic Contactor Bonding Bar Structure for Stable Semiconductor Testing
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Solution Overview
Problem
Conventional pogo pins used in semiconductor testing face challenges with miniaturization, instability in contact characteristics due to mechanical gaps, and increased contact resistance, making accurate testing difficult.
Innovation Solution
An elastic contactor with a hard head tip and conductive soft body silicone, featuring a bonding bar inserted into a bonding hole, suppresses separation and maintains stable bonding even with repeated buffering actions, manufactured as a single structure to avoid mechanical gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional pogo pins are used with mechanical assembly, then manufacturing is easier, but contact stability deteriorates due to mechanical gaps and machining tolerances
Solution Approach 1:
The patent merges the head tip and body silicone into a single integrated structure through direct bonding, eliminating the mechanical assembly interface that causes gaps and instability. The bonding bar inserted into the bonding hole creates a unified structure where the head tip is directly connected to the body silicone, removing the need for separate mechanical components and assembly steps.
Solution Approach 2:
The patent extracts and eliminates the mechanical gap that inherently exists in conventional assembled pogo pins. By directly bonding the head tip to the body silicone through the bonding hole structure, the design removes the intermediate mechanical interface that causes contact instability, achieving continuous contact without gaps.
2Measurement precision
If miniaturization is pursued for semiconductor testing, then testing capability improves, but contact resistance increases and stability decreases
Solution Approach 1:
The integrated bonding structure eliminates interface gaps that are particularly problematic in miniaturized devices. The direct connection between head tip and body silicone through the bonding bar ensures stable electrical contact even when overall device dimensions are reduced, maintaining low and stable contact resistance in miniaturized testing applications.
3Duration of action of moving object
If repeated buffering actions are performed, then testing durability improves, but bonding separation occurs in conventional designs
Solution Approach 1:
The bonding bar is pre-positioned in the bonding hole during manufacturing, creating a reinforced bonding interface before the product enters service. This preliminary structural reinforcement ensures that the bonding joint can withstand repeated buffering actions and mechanical stress throughout the product's service life without separation.
Solution Approach 2:
The patent uses a composite structure combining the hard head tip material with the soft body silicone material, connected through the bonding bar in the bonding hole. This composite design allows each material to perform its optimal function while the bonding interface reinforces the connection between dissimilar materials, preventing separation under repeated stress.
Data Source
AI summary
The present disclosure relates to a contactor that comes into contact with a test inspection device and a terminal of a semiconductor element during a semiconductor inspection process, and more specifically, to an elastic contactor that includes a hard head tip and a conductive soft body silicone, and in which a bonding bar formed in the body silicone is inserted into a bonding hole formed in the head tip, thereby suppressing separation of the head tip and the body silicone and reinforcing the bonding force even when repeated buffering actions are performed.