Elastic Cushion Pressing Ram for Non-Planar Power Electronics
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Solution Overview
Problem
Existing pressure-sintering technologies are limited to establishing connections only on planar surfaces, making it difficult to achieve connections of any desired geometry, particularly non-planar connections, which restricts the flexibility and efficiency in bonding power-electronics components.
Innovation Solution
An apparatus with a pressing ram featuring an elastic cushion element enclosed by a dimensionally stable frame, allowing for linear movement and quasi hydrostatic pressure distribution, enabling connections of any geometry by using a suspension arrangement and potentially heated or ultrasound-treated components, with a silicone cushion element stabilized by metallic additives for high-temperature and high-pressure applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a standard pressing apparatus with a rigid pressing ram is used, then planar connections can be established efficiently, but connections of non-planar geometry cannot be achieved
Solution Approach 1:
The pressing ram is equipped with an elastic cushion element (silicone rubber) that can deform elastically under pressure, allowing the pressing surface to adapt to non-planar geometries of connection partners while maintaining uniform pressure distribution across the contact area
Solution Approach 2:
The elastic cushion element changes its physical state from rigid to flexible under compression, enabling it to conform to various connection geometries. The material transitions from a rigid state during positioning to a compliant state during pressing, achieving both geometric adaptability and operational simplicity
2Manufacturing precision
If multiple connection partners are sintered one after another using standard presses, then each connection can be made with precision, but the processing time increases significantly
Solution Approach 1:
The apparatus enables simultaneous sintering of multiple connection partners by positioning them on a common pressing table and applying pressure through the elastic cushion element, which distributes force uniformly across all connections at once, thereby maintaining precision while dramatically increasing throughput
3Strength
If high pressure is applied to establish material-bonded connections, then connection strength is improved, but material damage or adverse effects may occur
Solution Approach 1:
The elastic cushion element acts as an intermediary between the pressing ram and the connection partners, distributing the applied pressure uniformly across the contact surface and preventing localized stress concentrations that could cause material damage, while still achieving sufficient connection strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the establishment of material-bonded, pressure-sintering connections of any geometry without adverse effects on materials, allowing for efficient and flexible bonding of power-electronics components, including substrates, semiconductor components, and composite film structures, at elevated temperatures and pressures.
Implementation Method 1
The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement
Implementation Method 2
The suspension arrangement here is formed by compression springs which are provided around guide-column elements
Data Source
AI summary
A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.