Elastic Fixing Board for Thermal Module on PCB

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Solution Overview

Problem

Conventional thermal modules face reduced heat conduction efficiency due to suboptimal contact with chips, leading to ineffective heat dissipation as the contact between the thermal module and the chip is not preferred.

Innovation Solution

A fixing structure comprising a fixing board with elastic strips and screw holes, positioned on studs and a positioning post, ensures secure contact between the thermal module and the chip on a printed circuit board, using screws and a positioning screw to restrict movement and reduce stress on the chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the thermal module contacts the chip directly, then heat conduction efficiency is improved, but the contact stability is insufficient leading to reduced heat dissipation effectiveness

Engineering Contradiction:
Improveheat conduction efficiencyVSAvoidcontact stability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent introduces a fixing board as an intermediary component between the thermal module and the chip. The fixing board includes positioning structures (positioning holes matching positioning posts) and fastening structures (screw holes with screws) that mediate the connection, ensuring both stable contact and proper alignment without direct rigid attachment between the thermal module and chip

Inventive Principle:
Principle #24Intermediary (Mediator)

2Stability of the object's composition

If screws are used to fix the thermal module, then the position is secured, but stress is applied to the chip

Engineering Contradiction:
Improveposition stabilityVSAvoidstress on chip
Core Design Contradiction:
Stability of the object's compositionVSStress or pressure

Solution Approach 1:

The patent segments the fixing function into multiple independent components: the fixing board separates the fastening function (screws into studs) from the positioning function (positioning posts in spacing holes), allowing the chip to be secured indirectly through the fixing board rather than applying direct stress through screws to the chip itself

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fixing board acts as a mediator that absorbs and distributes the mechanical stress from the screws. The screws fasten to the studs on the fixing board, not directly to the chip, thereby securing the thermal module's position while preventing stress concentration on the chip

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If the fixing board is positioned freely, then assembly is simple, but the chip receives excessive stress after screw fixation

Engineering Contradiction:
Improveassembly simplicityVSAvoidstress on chip
Core Design Contradiction:
Ease of manufactureVSStress or pressure

Solution Approach 1:

The patent implements preliminary positioning action through positioning posts that fit into spacing holes before final screw fixation. This preliminary action pre-establishes the correct position and orientation of the fixing board, ensuring that when screws are later tightened, the board cannot shift and apply excessive stress to the chip

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively fixes the thermal module in position, enhancing heat conduction efficiency by ensuring a stable and secure connection between the thermal module and the chip, thereby improving heat dissipation and reducing stress on the chip and PCB.

Implementation Method 1

The fixing board has a plurality of elastic strips, a plurality of screw holes

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS7903420B2Fixing structure of fixing a thermal module
Publication Date: 2011.03.08 ASUSTEK COMPUTER INC
  • US7903420B2 patent drawing
  • US7903420B2 patent drawing
  • US7903420B2 patent drawing

AI summary

A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.