Elastic Heat Conductor for CPU Thermal Management
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Solution Overview
Problem
Conventional electronic devices with heat conductive sheets between the housing and CPU face challenges in achieving effective heat radiation and shockproof performance due to size errors and variations, leading to inadequate heat transmission and potential damage from shocks.
Innovation Solution
A heat conductor comprising heat conductive rubber, a copper plate with bending elasticity, and elastic support members is used to transmit heat from the CPU to the housing, with the copper plate and support members designed to deform and absorb shocks, ensuring close contact and efficient heat dissipation even with size errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat conductive sheet is used between the housing and CPU, then heat transmission is improved, but shockproof performance deteriorates due to size errors and variations
Solution Approach 1:
The heat conductor is divided into multiple functional layers: a heat conductive rubber layer for shock absorption, a heat conductive plate for heat transmission, and heat conductive support members for structural stability. This segmentation allows each layer to specialize in one function, resolving the contradiction between heat transmission and shockproof performance
Solution Approach 2:
The patent uses composite material structure combining rubber (elastic, shock-absorbing) with metal plates (rigid, heat-conductive) and support members. This composite approach integrates the beneficial properties of different materials to simultaneously achieve heat transmission and shockproof performance
2Length of moving object
If the housing thickness is reduced, then device portability is improved, but heat radiation performance deteriorates
Solution Approach 1:
The heat conductive plate is designed with bending elasticity, allowing it to deform and maintain intimate contact with the CPU surface even in thin housings. This flexible thin-film approach enables effective heat transmission without requiring thick rigid structures
Solution Approach 2:
The patent changes the physical parameters of the heat conductor by introducing elastic materials with specific thermal conductivity properties. The heat conductive rubber and bending-elastic plate provide both flexibility and thermal conduction capability, enabling thin housing design with maintained heat radiation performance
3Manufacturing precision
If size errors and variations occur in conventional heat conductive sheets, then manufacturing tolerance is improved, but heat transmission efficiency deteriorates
Solution Approach 1:
The heat conductive plate is designed with bending elasticity, allowing it to dynamically adapt to size variations and maintain intimate contact with the CPU. This dynamic flexibility compensates for manufacturing tolerances while ensuring continuous thermal contact
Solution Approach 2:
The heat conductive rubber layer provides beforehand cushioning against dimensional variations, ensuring that the heat conductive plate maintains stable contact with the CPU despite size errors in other components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat radiation and shockproof performance while maintaining a thinner device thickness, effectively transmitting heat and absorbing shocks without compromising CPU durability.
Implementation Method 1
a heat conductive rubber (341) having elasticity
Implementation Method 2
a heat conductive plate (342) having bending elasticity
Implementation Method 3
heat conductive support members (343)...so as to abut the face and the heating element
Implementation Method 4
a heat conductive rubber (341) having elasticity
Implementation Method 5
a heat conductive plate (342) having bending elasticity...The heat conductive plate bending-deformed toward the face
Data Source
AI summary
A heat conductor of electronic device 1 includes a heat conductive rubber having elasticity, a heat conductive plate having elasticity so as to be bending deformable, and heat conductive support members, which are disposed between a bottom face of a housing and a CPU in order in a direction from the CPU to the bottom face so as to abut the bottom face and the CPU. The heat conductive support members are configured to abut the heat conductive plate at a plurality of positions separated away from the heat conductive rubber in a surface direction. The heat conductive plate bending-deformed toward the bottom face is supported by the heat conductive rubber and the heat conductive support members.