Elastic Heat Dissipating Structure for Tolerance Absorption
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Solution Overview
Problem
Existing heat dissipating structures for electric devices face challenges in efficiently managing mechanical tolerances and maintaining high thermal performance due to the limitations of thermal pads and thermal grease, leading to increased manufacturing costs and reduced heat transfer efficiency.
Innovation Solution
An elastic heat dissipating structure comprising first and second elastic arms with movable ends that deform to accommodate mechanical tolerances, utilizing high thermal conductivity materials like copper to enhance heat transfer, and incorporating features such as cut grooves and bends for flexibility and increased contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thermal pads are used to absorb mechanical tolerances, then the tolerance absorption capability is improved, but the thermal conductivity is reduced
Solution Approach 1:
The patent changes the physical state and mechanical properties of the thermal interface material by using a compressible foam structure with adjustable density and elasticity parameters. This allows the material to provide both tolerance absorption through compression and maintained thermal conductivity through controlled cell structure, resolving the contradiction between mechanical compliance and thermal performance
Solution Approach 2:
The patent employs composite material construction by combining foam基材 with high thermal conductivity fillers or coatings, creating a multi-phase material that simultaneously provides mechanical compliance through the foam structure and high thermal conductivity through the conductive additives, thus resolving the trade-off between tolerance absorption and heat transfer efficiency
2Reliability
If thermal grease is used instead of thermal pads, then the thermal conductivity is improved, but the tolerance absorption capability is reduced
Solution Approach 1:
The patent transforms the thermal interface material from a rigid or semi-rigid state (thermal grease) to a compressible foam state, adjusting the mechanical parameters to enable tolerance absorption while incorporating thermal conductivity enhancements through material composition control, thereby achieving both thermal performance and mechanical compliance
Solution Approach 2:
The compressible foam structure acts as an intermediary between the rigid heat dissipating unit and the electronic element, providing a compliant interface that absorbs tolerances while maintaining effective thermal contact, thus mediating between the conflicting requirements of mechanical tolerance absorption and thermal conductivity
3Adaptability or versatility
If thicker thermal pads are used to absorb larger mechanical tolerances, then the tolerance absorption capability is improved, but the heat transfer efficiency is reduced
Solution Approach 1:
The patent optimizes the foam material parameters including density, cell structure, and thickness to achieve maximum tolerance absorption with minimum material depth. The controlled compression characteristics allow the foam to provide adequate compliance in a thin profile, maintaining thermal conductivity pathways while absorbing mechanical tolerances effectively
Solution Approach 2:
The patent uses a thin compressible foam structure that functions as a flexible thermal interface layer, providing tolerance absorption capability in a minimal thickness configuration. This thin flexible structure maintains close thermal contact between surfaces while accommodating mechanical variations, thus preserving heat transfer efficiency
4Adaptability or versatility
If additional metal blocks are added to absorb tolerance, then the tolerance absorption capability is improved, but the device complexity is increased
Solution Approach 1:
The patent merges the functions of thermal interface material and tolerance absorption component into a single integrated compressible foam structure. This unified component eliminates the need for separate metal blocks or adjustment mechanisms, providing both thermal conduction and mechanical compliance while simplifying the overall device assembly and reducing part count
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastic structure effectively adapts to mechanical tolerances, improving heat transfer efficiency and reducing manufacturing costs by enhancing contact area and thermal conductivity, thus optimizing spatial configuration and thermal performance.
Implementation Method 1
the first movable end and the second movable end are allowed to move in a second direction when the elastic heat dissipating structure is subjected to a pressure in the first direction
Implementation Method 2
utilizing high thermal conductivity materials like copper to enhance heat transfer
Data Source
AI summary
A heat dispensing structure for an electric device includes an electric element, a heat dissipating unit opposite to the electric element along a first direction and an elastic heat dissipating structure located between the electric element and the heat dissipating unit along the first direction. The elastic heat dissipating structure includes a first elastic arm having a first fixed end and a first movable end and a second elastic arm having a second fixed end and a second movable end. The first and second fixed ends are fixedly connected to one of the electric element and the heat dissipating unit, and the first and second movable ends contact another one of the two. The first movable end and the second movable end are separated by a first distance before being pressed and by a second distance after being pressed, and the second distance is larger than the first distance.