Elastic Heat Dissipation Module for Thin Notebook Thermal Management
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Solution Overview
Problem
The increasing thickness of notebook computers limits heat dissipation capability due to reduced fan pressure and restricted space, which also affects the sound performance of speaker boxes.
Innovation Solution
An electronic device with a heat dissipation module incorporating an elastic member that is adjustable in volume, allowing for increased heat dissipation area and reduced flow resistance by stretching when the device is unfolded, thereby enhancing both heat dissipation and sound quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the notebook computer is designed to be thinner, then the portability is improved, but the heat dissipation capability is reduced
Solution Approach 1:
The heat dissipation fin is designed with elastic material that can dynamically change its volume and shape. When the notebook is opened, the fin expands to a larger volume to increase heat dissipation area. When closed, it compresses to a smaller volume to save space, allowing the notebook to be thinner while maintaining heat dissipation capability.
Solution Approach 2:
The patent changes the physical state and parameters of the heat dissipation fin by using elastic material properties. The fin transitions between compressed and expanded states, changing its volume and surface area parameters dynamically to resolve the contradiction between thin design and heat dissipation performance.
2Area of stationary object
If the heat dissipation area of the heat dissipation fin is increased, then the heat dissipation capability is improved, but the space occupied is increased
Solution Approach 1:
The heat dissipation fin uses elastic material to create a dynamic structure that can expand its heat dissipation area when needed (during use) and compress to a compact form when not in use or during transport. This dynamic volume adjustment allows large heat dissipation area without permanently occupying large space.
Solution Approach 2:
The elastic heat dissipation fin can be compressed into a compact nested form within the limited space of the notebook, similar to how nested dolls store within each other. When expanded, it provides large heat dissipation area, effectively solving the space-area contradiction.
3Length of moving object
If the notebook computer is designed to be thinner, then the portability is improved, but the sound performance of speaker box is reduced
Solution Approach 1:
The speaker box is constructed using elastic material that can dynamically change its volume. When the notebook is opened for use, the speaker box expands to provide larger volume for better sound performance. When closed, it compresses to minimize space occupation, enabling thin design while maintaining audio quality during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adjustable heat dissipation module improves heat dissipation efficiency and sound performance while maintaining a compact, thin design, addressing the limitations of traditional notebook computer designs.
Implementation Method 1
the elastic member is stretched. Based on the foregoing, in the design of the electronic device of the invention, the elastic member is fixed between the first housing and the cover plate, and the elastic member is stretched when being applied by an external force. In other words, a volume of the elastic member is adjustable.
Implementation Method 2
a heat pipe is used to transfer heat to an air outlet most of the time, and the heat is expelled from a system by using a fan together with a heat dissipation fin
Data Source
AI summary
An electronic device includes a first main body, a second main body, a pivoting mechanism, and a heat dissipation module. The second main body includes a first housing, a second housing, and a cover plate. The pivoting mechanism is pivotally connected between the first main body and the second main body. Two sides of the cover plate are pivotally connected to the second housing and the pivoting mechanism respectively. The heat dissipation module is disposed in the second main body and includes at least one elastic member. The elastic member is fixed between the first housing and the cover plate. In response to that the first main body is in unfolded position relative to the second main body through the pivoting mechanism, the pivoting mechanism drives the cover plate to be located between an open position relative to the second housing, so that the elastic member is stretched.