Elastic Heat-Dissipation Structure for Thin Electronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation methods in electronic devices, such as heat sinks and fans, become impractical for thinner, larger, and high-performance devices due to increased weight and reduced structural strength, necessitating a more efficient and lightweight solution.
Innovation Solution
An elastic heat-dissipation structure comprising a porous elastic member mixed with first and second thermal conductive members, where the thermal conductive members are made of materials like graphene microchips, providing effective heat dissipation and vibration absorption while maintaining thinness and high performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal material with high thermal conductivity is used for heat dissipation, then heat dissipation performance is improved, but weight and thickness increase
Solution Approach 1:
The patent uses polymer composite material doped with inorganic materials (boron nitride, aluminum nitride) to create a heat dissipation structure that combines the low weight and thickness advantages of polymers with the high thermal conductivity of inorganic materials, resolving the contradiction between heat dissipation performance and weight/thickness
Solution Approach 2:
The patent employs porous elastic member structure that provides heat dissipation pathways while maintaining lightweight characteristics. The porous structure allows for thermal management without requiring dense metal materials, thus reducing weight while achieving effective heat dissipation
2Temperature
If metal material with high thermal conductivity is used for heat dissipation, then heat dissipation performance is improved, but thickness increases
Solution Approach 1:
The polymer composite material with inorganic doping enables high thermal conductivity in a thin layer, avoiding the need for thick metal heat sinks. The composite structure achieves effective heat dissipation with minimal thickness addition to the device
Solution Approach 2:
The elastic heat dissipation structure is designed as a thin film that can be integrated into the device without significantly increasing thickness. The thin film structure provides sufficient thermal management while maintaining the device's slim profile
3Weight of moving object
If polymer composite material doped with inorganic material is used for heat dissipation, then weight and thickness are reduced, but structural strength deteriorates
Solution Approach 1:
The patent uses polymer composite material doped with inorganic materials (boron nitride, aluminum nitride) which provides both the lightweight advantage of polymers and the structural reinforcement from inorganic materials, achieving a balance between weight reduction and structural strength
Solution Approach 2:
The porous elastic member structure is designed to provide mechanical support while maintaining low weight. The porous architecture distributes stress effectively, providing sufficient structural strength for the application while keeping the material lightweight
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastic heat-dissipation structure efficiently transfers heat and absorbs vibrations, meeting the requirements of thin, large, and high-performance electronic devices by leveraging the thermal conductivity and elasticity of the porous material, while also potentially offering electromagnetic wave shielding.
Implementation Method 1
a plurality of first thermal conductive members and a plurality of second thermal conductive members are mixed in the porous elastic member
Implementation Method 2
an elastic heat-dissipation structure, which comprises a porous elastic member
Data Source
AI summary
An elastic heat-dissipation structure comprises a porous elastic member, a plurality of first thermal conductive members, and a plurality of second thermal conductive members. The first thermal conductive members and the second thermal conductive members are mixed in the porous elastic member. Each first thermal conductive member has a maximum width ranged from 5 μm to 50 μm, each second thermal conductive member has a maximum width ranged from 0 μm to 5 μm, and the thicknesses of each first thermal conductive member and each second thermal conductive member ranges from 0.3 nm to 30 nm. When the density of the elastic heat-dissipation structure is between 0.1 g/cm3 and 1.0 g/cm3, the contained percentages of the first thermal conductive members and the second thermal conductive members range from 0.01% to 20%. An electronic device containing the elastic heat-dissipation structure is also disclosed.