Elastic Heat Spreader Assembly for Stable Chip Cooling
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Solution Overview
Problem
High-power chip integration leads to increased heat dissipation challenges due to heat conducting materials with high adhesion and temperature resistance but low heat conductivity, which cannot effectively meet chip heat dissipation requirements in surface mount technology.
Innovation Solution
A heat dissipation assembly comprising a heat spreader, frame body, and elastic structure that ensures reliable contact and positioning, allowing for the use of materials with better heat dissipation performance while maintaining stability and efficiency, including a metallic heat spreader and elastic structure for enhanced heat conduction and clamping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat conducting material with good adhesion and high-temperature resistance is used, then the adhesion and temperature resistance are improved, but the coefficient of heat conductivity deteriorates (remains low at approximately 2 W/mK)
Solution Approach 1:
The patent divides the heat dissipation system into three separate functional components: a heat conducting material layer (providing adhesion and temperature resistance), a heat spreader (providing high heat conductivity), and a frame body with elastic structure (providing clamping force). This segmentation allows each component to optimize its specific function without compromise, resolving the contradiction between adhesion/temperature resistance and heat conductivity.
Solution Approach 2:
The patent employs a composite structure combining different materials with complementary properties: the heat conducting material layer uses materials optimized for adhesion and thermal stability, while the heat spreader uses high-conductivity materials such as aluminum or copper. This composite approach allows the system to achieve both good adhesion/temperature resistance and high heat conductivity simultaneously.
2Ease of operation
If the heat spreader is allowed to move freely, then the installation flexibility is improved, but the heat dissipation interface stability deteriorates (causing damage due to movement)
Solution Approach 1:
The patent introduces a dynamic clamping mechanism using an elastic structure that can deform to accommodate thermal expansion and mechanical stress while maintaining constant contact pressure. The elastic structure provides adaptive constraint that allows for installation flexibility while ensuring the heat dissipation interface remains stable during operation, resolving the contradiction between ease of installation and interface stability.
Solution Approach 2:
The patent changes the mechanical constraint parameters by using an elastic structure with specific elasticity parameters that allow controlled deformation. This enables the system to transition from a rigid constraint (which would prevent movement but also prevent flexibility) to a flexible constraint that maintains stability while allowing installation ease, resolving the contradiction between installation flexibility and interface stability.
3Reliability
If a coverage area of the frame body on the heat spreader is increased to improve positioning, then the positioning stability is improved, but the heat conduction performance deteriorates (affects heat conduction performance)
Solution Approach 1:
The patent applies local quality by concentrating the frame body's contact with the heat spreader at specific localized areas (edges or corners) rather than covering the entire surface. This localized constraint provides sufficient positioning stability while minimizing the impact on the heat spreader's overall heat conduction performance, as the contact areas are small and do not significantly interfere with heat flow paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation efficiency by reducing thermal resistance and increasing the coefficient of heat conductivity, achieving a heat dissipation gain of 7° C. to 11° C. and reducing power consumption, while maintaining structural stability and space efficiency.
Implementation Method 1
The heat spreader is configured to be in contact with the element, and can evenly conduct heat generated by the element
Implementation Method 2
The elastic structure may be in contact with another component in an electronic device and thereby become deformed
Data Source
AI summary
A heat dissipation assembly includes: a heat spreader, configured to be in contact with an element; a frame body, configured to limit a position of the heat spreader, where the frame body surrounds a side wall of the heat spreader; and an elastic structure, fixedly connected to the frame body. In this application, the heat spreader is disposed, so that heat generated by the element can be evenly conducted; furthermore, the elastic structure fixedly connected to the frame body is disposed, so that the element, the heat spreader, and the frame body are reliably fastened in a thickness direction, to ensure that heat generated by the element can be smoothly conducted. In addition, because a requirement on adhesion strength of a heat conducting material is reduced, a heat conducting material with better heat dissipation performance can be selected, thereby further improving and heat dissipation efficiency of a chip is further improved.