Elastic Interconnect Contact for Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional IC sockets face mechanical and electrical limitations, particularly with increased terminal counts and reduced terminal pitch, leading to parasitic effects and signal integrity issues, which are exacerbated as systems operate above 5 GHz, necessitating a revision in interconnect design to meet next-generation requirements.
Innovation Solution
The development of an electrical interconnect with metallic contact structures that mimic a simple beam structure, eliminating retention features to reduce parasitic mass and enhance signal integrity, featuring a substrate with translating layers and through holes to elastically deform contact members, allowing for fine pitch connections and solder-free installation and removal of IC devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional IC sockets are used with increased terminal counts and reduced terminal pitch, then more terminals can be connected, but parasitic effects and signal integrity issues worsen
Solution Approach 1:
The patent changes the physical parameters of the contact member by transitioning from a rigid structure to a compliant structure with controlled elastic deformation. The contact member is designed to deflect elastically under load, creating intimate contact with the terminal while accommodating topography differences. This parameter change reduces parasitic effects and improves signal integrity by ensuring reliable electrical connection without excessive force
Solution Approach 2:
The patent introduces dynamic compliance to the contact member through elastic deformation capability. The contact member can dynamically adjust its shape and position in response to applied loads and topography variations, maintaining optimal contact pressure and electrical connection. This dynamic behavior reduces parasitic effects compared to rigid traditional sockets
2Quantity of substance
If the package size is increased to accommodate more terminals, then terminal count increases, but cost and compliance requirements worsen
Solution Approach 1:
The patent changes the mechanical parameters of the contact member by introducing elastic compliance. The contact member is designed with specific material properties and geometric features that enable it to deflect and conform to the terminal surface. This compliance reduces the need for precise flatness control in the package and PCB, simplifying manufacturing requirements while accommodating high terminal counts
3Volume of moving object
If terminal pitch is reduced to decrease package size, then package size decreases, but contact placement area and spring deflection space worsen
Solution Approach 1:
The patent utilizes the third dimension (vertical deflection) to accommodate contact member compliance within the limited planar space. The contact member deflects vertically to create intimate contact, allowing adequate deflection length without increasing the planar footprint. This dimensional approach enables fine pitch connections while maintaining sufficient spring deflection capability
Solution Approach 2:
The patent changes the material and geometric parameters of the contact member to optimize the ratio of deflection length to planar dimensions. By selecting appropriate materials with suitable elastic properties and designing the contact member geometry, the patent achieves adequate compliance in a compact form factor, enabling reduced terminal pitch without sacrificing contact member performance
4Ease of operation
If long contact members are used to maximize spring deflection, then compliance improves, but electrical performance and parasitic effects worsen
Solution Approach 1:
The patent optimizes the parameters of the contact member by selecting materials and dimensions that provide adequate compliance with minimized length. The contact member is designed with specific elastic moduli and cross-sectional properties that enable sufficient deflection capability while keeping the electrical path as short as possible. This parameter optimization reduces parasitic inductance and resistance while maintaining compliance
Solution Approach 2:
The patent introduces dynamic compliance through elastic deformation rather than relying on excessive length. The contact member dynamically adjusts its shape under load, providing compliance through controlled deflection rather than through length. This dynamic approach achieves the necessary compliance while minimizing the electrical path length and associated parasitic effects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high signal performance and low-profile interconnects suitable for high-frequency applications, allowing for fine contact-to-contact spacing, reducing cross-talk, and enabling IC devices to be installed and uninstalled without reflowing solder, while maintaining reliable connections and environmental sustainability.
Implementation Method 1
Translation of the two adjacent layers of the substrate from the nominal position to the translated position elastically deforms the contact members within the through holes of the substrate and displaces the distal portions of the contact members toward the conductive structures
Data Source
AI summary
An electrical interconnect including a substrate with at least two adjacent layers configured to translate relative to each other between a nominal position and a translated position. A plurality of through holes are formed through the layers from a first surface of the substrate to a second surface of the substrate in both the nominal position and the translated position. At least one contact member is positioned in the through holes with distal portions accessible from the first surface and a proximal portions positioned near the second surface. The proximal portion of the contact members are secured to the substrate near the second surface with a conductive structure. The two adjacent layers of the substrate are translated from the nominal position to the translated position to elastically deform the contact members within the through holes and to displace the distal portions of the contact members toward the conductive structures, respectively.