Elastic Lead Insertion for Through-Hole Component Mounting

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Solution Overview

Problem

Existing board work machines lack a specific method for accurately inserting leads of leaded components into through-holes of a board, especially when the leads contact the board's surface without direct insertion.

Innovation Solution

A board work machine equipped with a holding tool and a moving device, controlled by a control device, which elastically deforms the lead to guide it into the through-hole while contacting the board's surface, allowing for precise insertion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the lead is moved directly into the through-hole without contacting the board surface, then the insertion process is simpler, but the lead cannot be inserted when it contacts the board surface first

Engineering Contradiction:
Improveinsertion process simplicityVSAvoidhandling capability when lead contacts board surface
Core Design Contradiction:
Ease of operationVSAdaptability or versatility

Solution Approach 1:

The holding tool is designed to move the lead in a dynamic, multi-stage motion pattern. First, the lead tip contacts the board surface and is moved along it. Then, when the through-hole is detected, the holding tool lifts the lead and inserts it into the hole. This dynamic motion sequence allows the system to adapt to different insertion scenarios, resolving the contradiction between simple direct insertion and versatile surface-contact handling.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system performs preliminary actions by first moving the lead along the board surface to detect the through-hole position before actual insertion. This preliminary surface-contact phase allows the system to locate and align with the through-hole, preparing for the subsequent insertion action. This resolves the contradiction by adding a preparatory step that enables both surface-contact capability and successful insertion.

Inventive Principle:
Principle #10Preliminary action

2Force

If the lead is forced into the through-hole without elastic deformation, then the insertion force is reduced, but the lead cannot navigate along the board surface

Engineering Contradiction:
Improveinsertion forceVSAvoidlead guidance along surface
Core Design Contradiction:
ForceVSEase of operation

Solution Approach 1:

The system changes the physical state parameter of the lead by applying elastic deformation. The holding tool bends the lead elastically to follow the board surface contour during movement. When the through-hole is reached, the elastic deformation allows the lead to flex into the hole with reduced force. This parameter change resolves the contradiction between needing force for insertion and needing flexibility for surface guidance.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The holding tool acts as an intermediary that applies controlled elastic deformation to the lead. It mediates between the insertion force requirement and the surface-following requirement by temporarily storing energy through elastic bending and releasing it during insertion. This intermediary action resolves the contradiction by transforming the lead's rigid state into a flexible state that can navigate the surface and then insert smoothly.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If general mounting methods are used for all components, then the system is simpler to operate, but specific leaded components cannot be properly inserted

Engineering Contradiction:
Improvesystem operation simplicityVSAvoidleaded component insertion accuracy
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The holding tool is designed with multi-functionality to handle both general component mounting and specific leaded component insertion. It can perform standard pickup-and-place operations for simple components while also executing the complex multi-stage motion sequence required for leaded components. This universal design resolves the contradiction by enabling one tool to perform both simple and complex tasks without requiring separate specialized equipment.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The control system dynamically adjusts its operation mode based on the component type. For leaded components, it activates the specialized multi-stage insertion sequence with surface contact and elastic deformation. For other components, it uses the simpler general mounting method. This dynamic adaptation allows the system to maintain simplicity for routine operations while achieving high precision for specific cases, resolving the contradiction between operational simplicity and insertion accuracy.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables successful insertion of leads into through-holes even when they initially contact the board's surface, preventing damage and improving insertion efficiency by using a controlled, elastic deformation mechanism.

Implementation Method 1

moving the lead of the leaded component being held by the holding tool in a state contacting the upper surface of the board and being elastically deformed so as to insert the lead into a through-hole formed in the board

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentEP3379911B1Substrate work machine and insertion method
Publication Date: 2021.10.27 FUJI CORP
  • EP3379911B1 patent drawingFigure 1
  • EP3379911B1 patent drawingFigure 2
  • EP3379911B1 patent drawingFigure 3

AI summary

A component mounter provided with a component holding tool that holds leaded component 92, and a moving device that moves the component holding tool to a given position, wherein leads 94 of leaded component 92 held by the component holding tool are contacted against the upper surface of circuit board 12, are moved in a state being elastically deformed, and are inserted into through-hole 200 of circuit board 12. Thus, even in a case in which leads 94 are contacted against the upper surface of circuit board 12 without leads 94 being directly inserted into through-holes 200, it is possible to insert leads 94 into through-holes 200. Also, it is possible to prevent plastic deformation of leads 94 by leads 94 being pressed too much in a state contacting the upper surface of circuit board 12.