Elastic Member for Heat Dissipating Structure Connection

The patent introduces an elastic member that changes the mechanical contact parameter between the heat dissipating plate and electronic element. By using an elastic material with specific hardness (50-80 Shore A) and designing the member with adjustable thickness (1-5mm), the contact pressure and thermal contact resistance are optimized, ensuring reliable thermal connection without energy loss.

The elastic member is made of elastomeric material that combines mechanical compliance with thermal conductivity. This composite approach allows the member to simultaneously provide mechanical cushioning for reliable connection and thermal conduction path for efficient heat dissipation, resolving the contradiction between connection reliability and heat dissipation efficiency.

The patent optimizes the thickness parameter of the elastic member within a specific range (1-5mm) to balance cushioning effect and heat dissipation. The elastic modulus and thickness are adjusted to achieve the desired contact pressure while minimizing thermal resistance, ensuring both mechanical protection and thermal performance.

The elastic member is designed with non-uniform thickness distribution, being thicker at the edges for enhanced cushioning and thinner at the center for improved heat conduction. This local quality variation allows the single component to simultaneously satisfy both mechanical cushioning requirements and thermal dissipation requirements.