Elastic Mold Protrusions Seal Camera Sensing Areas
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Solution Overview
Problem
Existing injection molding methods for photoelectric components, such as camera modules, face challenges in sealing the sensing area due to the limited deformation ability of the release film, which can lead to insufficient sealing when the chip is inclined relative to the substrate, requiring modifications to the mold shape to accommodate the film and potentially compromising the seal.
Innovation Solution
The method employs an injection mold with protrusions made of elastic material that abut against a sealant around the sensing area, preventing the injection material from entering the sensitive region and compensating for height differences, eliminating the need for a release film and allowing for improved sealing without mold shape adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soft release film is used to cover the sensing area, then the sensing area can be isolated from the plastic material, but the release film has limited deformation ability and cannot sufficiently seal the sensing area when the chip is inclined relative to the substrate
Solution Approach 1:
The patent changes the material parameter of the mold surface from a soft release film with limited deformation to a rigid mold surface with high deformation capacity through the elastic protrusions. The protrusions can elastically deform to adapt to chip inclination while maintaining sealing effectiveness.
Solution Approach 2:
Instead of using a soft film that tries to conform to the chip surface, the patent inverts the approach by using a rigid mold with elastic protrusions that actively deform to seal against the chip edges, reversing the traditional soft-seal concept.
2Strength
If the release film thickness is reduced to ensure adhesion to the upper mold, then the film can adhere better, but the deformation ability becomes even more limited
Solution Approach 1:
The patent extracts and removes the release film from the system entirely, replacing it with elastic protrusions integrated into the mold structure. This eliminates the conflicting requirements of adhesion versus deformation in a thin film.
Solution Approach 2:
The patent uses composite material strategy by combining rigid mold material with elastic protrusion material, creating a structure that has both the rigidity needed for mold strength and the elasticity needed for adaptation to chip inclination.
3Ease of manufacture
If the mold shape is modified to accommodate the release film's deformation limitations, then the film can be used, but the sealing effectiveness is compromised
Solution Approach 1:
The patent introduces dynamic elastic protrusions that can deform during the injection process to accommodate chip inclination, replacing the static mold shape modification approach. This maintains both manufacturing simplicity and sealing effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures effective sealing of the sensing area, reducing the risk of injection material intrusion and accommodating chip inclination, thereby enhancing the reliability of the packaging structure without requiring modifications to the mold's internal shape to adapt to the release film's deformation limitations.
Implementation Method 1
The method employs an injection mold with protrusions made of elastic material that abut against a sealant around the sensing area, preventing the injection material from entering the sensitive region and compensating for height differences
Data Source
AI summary
An injection molding method which can isolate injection materials from flowing into the sensing area includes: providing an injection mold comprising a first mold and a second mold; placing a component to be packaged on the second mold; arranging a sealant on a non-sensing area of the component to be packaged; placing the first mold on the component to be packaged; injecting a molding material and curing the molding material to form an encapsulation portion; removing the injection mold. A packaging structure and a camera module carrying it are also disclosed.