Elastic Mounting Structure for Heat Dissipating Module
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Solution Overview
Problem
Conventional heat dissipation structures for computer on modules suffer from increased thermal contact resistance and lack of stress buffer due to non-closely attached thermal pads, leading to inefficient heat dissipation and module detachment under external vibrations.
Innovation Solution
An elastic mounting structure comprising a carrier circuit board, main circuit board, heat dissipating module, and elastic mounting components that provide stress buffer and bonding effect, with thermal paste or phase change material for thermal conduction, and hexagonal polygonal head parts for secure fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermal pad is used as tolerance buffer between heat dissipating module and heat source component, then assembly tolerance is absorbed, but thermal contact resistance increases due to non-closely attached surfaces
Solution Approach 1:
The patent changes the physical state of the thermally conductive material from solid (thermal pad) to viscous fluid (thermal paste), allowing it to flow into and fill microscopic gaps between surfaces. This parameter change enables the material to conform to surface irregularities, achieving both tolerance buffering and low thermal contact resistance simultaneously.
Solution Approach 2:
The patent uses a composite approach by combining thermal paste (viscous thermally conductive material) with elastic mounting components (elastic elements). This composite system provides both the fluidity needed for low thermal contact resistance and the elastic properties needed for stress buffering and maintaining intimate thermal contact.
2Strength
If structural screws are used to tightly mount heat dissipating module, then mechanical strength is improved, but stress buffer is lost causing module detachment under external vibration
Solution Approach 1:
The patent replaces rigid structural screws with elastic mounting components that incorporate elastic elements. This dynamic solution allows the mounting structure to flex and absorb external vibrations while maintaining secure attachment. The elastic elements deform under vibration stress and return to their original position, preventing module detachment while maintaining mounting strength.
Solution Approach 2:
The elastic mounting components provide beforehand cushioning by incorporating elastic elements that can deform to absorb external vibration stress before it reaches the heat dissipating module. This pre-cushioning mechanism protects the module from vibration-induced detachment while maintaining secure mounting.
3Reliability
If thermal paste is used as thermally conductive material, then thermal contact resistance is reduced, but stress buffer is not provided causing easy detachment under external vibration
Solution Approach 1:
The patent merges the functions of thermal conduction and stress buffering into a single integrated mounting structure. The elastic mounting components simultaneously provide mechanical attachment, stress buffering through elastic deformation, and maintain intimate thermal contact by applying pressure. This merging eliminates the need for separate thermal paste and mounting components.
Solution Approach 2:
The patent creates a composite system combining elastic mounting components with thermally conductive materials. The elastic elements provide mechanical strength and stress buffer, while the thermally conductive material (thermal paste or phase change material) provides low thermal contact resistance. This composite approach resolves the contradiction between thermal performance and mechanical buffering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conduction and stability by reducing thermal contact resistance and absorbing assembly tolerance, ensuring effective heat dissipation and secure bonding between the heat dissipating module and heat source device.
Implementation Method 1
the plurality of elastic mounting components can provide stress buffer and good bonding effect for the thermally conductive device of the heat dissipating module bonded on an upper surface of the heat source device
Implementation Method 2
the thermally conductive device of the heat dissipating module bonded on an upper surface of the heat source device
Implementation Method 3
a phase change material can be attached between the thermally conductive device of the heat dissipating module and the upper surface of the heat source device, for thermal conduction
Data Source
AI summary
A heat-dissipating module having an elastic mounting structure includes a carrier circuit board, a main circuit board, a heat dissipating module, and a plurality of elastic mounting components configured to mount mounting holes of the carrier circuit board and mounting grooves of the heat dissipating module in series, so as to fix the carrier circuit board, the main circuit board and the heat dissipating module. As a result, the plurality of elastic mounting components can provide stress buffer and good bonding effect for the thermally conductive device of the heat dissipating module bonded on an upper surface of the heat source device.