Elastic Probe Tip Contact for Damage-Free MEMS Inspection

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Solution Overview

Problem

Existing microstructure inspection methods for MEMS structures risk damaging the delicate structures and leaving imprints or scratches during electrical probing due to the use of hard probe tips that deform or scratch the surface.

Innovation Solution

A microstructure inspection device with an elastically deformable probe tip surface that deforms elastically when subjected to a predetermined force threshold, allowing electrical contact without damaging the MEMS structure or leaving imprints, using materials with Shore hardness values between 0-60.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If hard probe tips (tungsten, palladium alloys) are used for electrical probing, then electrical contact reliability is improved, but surface damage (imprints and scratches) occurs on the MEMS structure

Engineering Contradiction:

Improveelectrical contact reliabilityVSAvoidsurface damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the physical parameter of the probe tip material from hard (tungsten, palladium alloys) to soft (Shore hardness 0-60). This parameter change allows the probe to deform elastically under contact force, distributing the pressure over a larger area and preventing surface damage while maintaining electrical contact reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a soft, elastically deformable probe tip surface that acts as a flexible element. When contact force is applied, the probe tip deforms elastically rather than rigidly, allowing it to conform to the MEMS surface without causing imprints or scratches, thus resolving the contradiction between reliable contact and surface protection

Inventive Principle:

Principle #30Flexible shells and thin films

2Ease of operation

If regular hard probes are used to contact MEMS structures, then electrical testing capability is achieved, but delicate MEMS features (suspended beams, membranes) are damaged

Engineering Contradiction:

Improveelectrical testing capabilityVSAvoidMEMS structure integrity

Core Design Contradiction:

Ease of operationVSStrength

Solution Approach 1:

The patent changes the hardness parameter of the probe tip to be softer than the MEMS structure materials. This allows the probe to apply sufficient force for reliable electrical contact while remaining gentle enough not to damage delicate features like suspended beams and membranes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The soft probe tip material acts as a cushioning element before contact with the MEMS structure. The elastic deformability of the probe tip absorbs and distributes contact forces, preventing damage to delicate MEMS features while enabling electrical testing

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If increased contact force is applied to ensure electrical contact, then contact reliability is improved, but probe tip deformation exceeds elastic threshold causing permanent damage

Engineering Contradiction:

Improvecontact reliabilityVSAvoidprobe tip dimensional accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the material parameter of the probe tip to have high elastic deformability with a high deformation threshold. This allows the probe to undergo large elastic deformations under contact force without exceeding the yield point, maintaining both contact reliability and dimensional accuracy

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The soft probe tip surface is designed as a consumable element that can be replaced. While the probe tip may deform during use, it remains within elastic limits for a controlled number of contacts, after which it can be replaced, ensuring continuous operation without compromising measurement precision

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables reliable electrical inspection of MEMS structures without surface deformation or damage, allowing for larger contact areas and simultaneous contact with multiple features, reducing the risk of mechanical deformation and scratches.

Implementation Method 1

an electrically conductive and elastically deformable probe tip surface that is configured to deform elastically when subjected to a force greater than a predetermined deformation threshold value

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS20260086115A1Microstructure inspection device and system and use of the same

Publication Date: 2026.03.26 SILEX MICROSYSTEMS AB

AI summary

A microstructure inspection device and system for inspecting an electrical characteristic of at least one micro electromechanical system (MEMS) structure formed in or on a substrate including a probe tip having an electrically conductive and elastically deformable probe tip surface configured to deform elastically when subjected to a force greater than a predetermined deformation threshold value, and a pusher for pushing the probe tip in a first direction against the substrate with an abutment force that is greater than the predetermined deformation threshold value, thereby causing the probe tip surface to deform elastically. The pusher is configured to push the probe tip in the first direction and/or a substrate pusher is configured to push the substrate against the probe tip with an abutment force that is greater than the predetermined deformation threshold value, thereby causing the probe tip surface to deform elastically.