Elastic Protrusion Substrate Holder for Wafer Positioning
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Solution Overview
Problem
In semiconductor and FPD manufacturing lines, existing substrate holding methods face challenges such as weak frictional forces, misalignment issues, and limitations in high-temperature processes, particularly with the rear surface friction and taper pad methods, while vacuum adsorption methods are complex and not suitable for vacuum environments.
Innovation Solution
A substrate holder with a pad main body and elastically transformable protruding portions that contact both the rear and side surfaces of the substrate, allowing for adjustable holding forces and stability regardless of substrate alignment or temperature, and can be easily attached to transfer arms without special equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum adsorption method is used to hold substrate, then substrate holding reliability is improved, but device complexity increases
Solution Approach 1:
The substrate holder is divided into multiple independent protruding portions that can be separately arranged and configured. Each protruding portion independently contacts the substrate at different locations, allowing the system to achieve reliable substrate holding through distributed contact points rather than a complex unified vacuum system.
Solution Approach 2:
Instead of using suction from below (vacuum method), the invention uses protruding portions extending upward to contact and hold the substrate from the bottom surface. This inverted approach simplifies the structure by eliminating the need for vacuum channels and pumping systems while maintaining reliable holding.
2Device complexity
If rear surface friction method is used to hold substrate, then device complexity is reduced, but substrate holding reliability deteriorates
Solution Approach 1:
The holder uses multiple discrete protruding portions instead of a single friction surface. Each protruding portion provides independent contact and holding force, distributing the holding load and improving reliability while keeping each individual component simple in structure.
Solution Approach 2:
Different regions of the substrate are contacted by protruding portions at optimized locations. The protruding portions are strategically positioned to contact the substrate at points that maximize holding effectiveness, applying local quality variations to improve overall holding reliability.
3Productivity
If transfer speed is increased to improve productivity, then substrate misalignment and falling increase
Solution Approach 1:
The protruding portions are designed to contact and secure the substrate before the transfer motion begins. By establishing firm contact points in advance, the substrate is pre-positioned and secured, preventing misalignment and falling even during high-speed transfer operations.
Solution Approach 2:
The protruding portions are designed with elastic properties, allowing them to dynamically adapt to substrate positioning variations during transfer. This dynamic characteristic enables the holder to maintain reliable contact and positioning accuracy even during high-speed movements with potential vibrations or position deviations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate holder provides stable and reliable substrate positioning, improving transfer efficiency and throughput by allowing for flexible arm positioning and speed, while being cost-effective and resistant to substrate surface changes and bending.
Implementation Method 1
a plurality of protruding portions which extend from the pad main body and are elastically transformable
Implementation Method 2
the substrate is held by using a frictional force between a rear surface of the substrate and a pad surface
Data Source
AI summary
In the substrate holder, while holding a periphery portion of a semiconductor wafer, some of protruding portions having a grass shape on a pad main body hide beneath the semiconductor wafer, and the others of the protruding portions are exposed outside the semiconductor wafer. Also, the protruding portions hiding beneath the semiconductor wafer contact a rear surface of the semiconductor wafer, and sink the semiconductor wafer to a suitable depth via gravity, thereby holding the semiconductor wafer mainly in a length direction. In addition, some of protruding portions exposed near the periphery portion of the semiconductor wafer contact a side surface of the semiconductor wafer, thereby holding the semiconductor wafer mainly in a width direction.