Airtight Semiconductor Container with Elastic Sealing
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Solution Overview
Problem
Current semiconductor transferring containers fail to maintain an airtight status, leading to contamination and crystal formation on wafers/masks due to poor sealing, material gas emissions, and particle generation during gas filling, which limits the semiconductor manufacturing process and contradicts Moore's law expectations.
Innovation Solution
An airtight semiconductor transferring container is designed with an elastically deformable inner lining shell and packing member, along with silver powder in the plastic material to absorb sulfides, ensuring a tight seal and preventing crystal formation, using a springy holding down sheet member for gas filling and a silver-contained plastic material to absorb sulfides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional rigid sealing structures are used in semiconductor transferring containers, then the structure is simple and easy to manufacture, but the sealing reliability deteriorates due to inability to adapt to dimensional changes and maintain consistent contact pressure
Solution Approach 1:
The patent employs flexible sealing members comprising elastic bodies with circumferential sealing surfaces that can deform elastically to maintain consistent contact pressure with the container lid flange. This flexibility allows the sealing structure to adapt to dimensional changes and thermal expansion while maintaining reliable sealing, directly resolving the contradiction between sealing reliability and structural simplicity.
Solution Approach 2:
The sealing members are designed with elastic deformation capability, allowing them to dynamically adjust their shape and contact pressure in response to external forces, temperature changes, and dimensional variations. This dynamic adaptation ensures continuous reliable sealing without requiring complex rigid adjustment mechanisms.
2Reliability
If rigid packing members are used to maintain sealing contact, then the structure is simple, but the sealing performance deteriorates when dimensional changes occur due to inability to maintain consistent contact pressure
Solution Approach 1:
The packing members are constructed from elastic materials with circumferential packing surfaces that can deform to maintain consistent contact pressure with the container body flange. This elastic deformation capability allows the packing members to accommodate dimensional changes and thermal expansion while maintaining effective sealing contact.
Solution Approach 2:
The packing members are designed to dynamically adjust their contact pressure through elastic deformation, ensuring continuous effective sealing contact with the container body flange despite dimensional variations, temperature changes, or assembly tolerances without requiring complex rigid adjustment mechanisms.
3Object-affected harmful factors
If conventional sealing structures are used, then the device is simple to manufacture, but particle generation occurs during gas filling operations compromising wafer cleanliness
Solution Approach 1:
The flexible sealing members with circumferential sealing surfaces conform to the flange geometry and create effective sealing contact without requiring complex rigid structures. This flexibility allows gas filling operations to proceed without particle generation from rigid component contact, while the overall structure remains simple to manufacture.
Solution Approach 2:
The patent converts the potential harm of gas filling operations (which can generate particles in rigid structures) into a beneficial process by using flexible sealing members that accommodate gas flow without creating particle-generating contact points, thereby eliminating contamination while maintaining manufacturing simplicity.
4Reliability
If non-elastic sealing materials are used, then the material selection is simple and cost-effective, but the sealing capability deteriorates under dimensional changes and thermal expansion
Solution Approach 1:
The sealing members are constructed from elastic materials that can deform to maintain sealing contact under dimensional changes and thermal expansion. This material flexibility provides reliable sealing capability while the overall structure remains relatively simple, avoiding the need for complex multi-material composite structures.
Solution Approach 2:
The patent utilizes materials with appropriate elastic modulus and thermal expansion coefficients that allow the sealing members to deform and maintain contact pressure under varying temperature and dimensional conditions. This parameter optimization provides reliable sealing capability through material selection rather than complex structural design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The container maintains an airtight environment, preventing contamination and crystal formation, enhancing the semiconductor manufacturing process by adhering to Moore's law expectations and ensuring longer storage viability of wafers/masks.
Implementation Method 1
an elastically deformable inner lining shell (42) fitted into the outer cover body (41)... the downwardly protruding peripheral flange (421) of the inner lining shell (42) is pressed on the border area of the packing member (2)... keeping the inside space in an airtight status
Implementation Method 2
silver power in the plastic material to absorb sulfides, preventing crystal formation
Data Source
AI summary
An airtight semiconductor transferring container is disclosed to included a container base, an elastically deformable packing member covered on the top surface of the container base, and a top cover closed on the container base, the top cover having an outer cover body, and an elastically deformable inner lining shell fitted into the outer cover body, the elastically deformable inner lining shell having a downwardly protruding peripheral flange, which is pressed on the border area of the elastically deformable packing member to keep the inside space of the airtight semiconductor transferring container in an airtight status after closing of the top cover on the container base.