Elastic Mounting for Semiconductor Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor element mount structures face challenges in achieving stable heat dissipation due to material limitations, assembly errors, and varying heights of semiconductor elements, leading to inefficient heat dissipation and potential damage under high voltage conditions.
Innovation Solution
A mounting structure featuring a fixing member with elastic elements, such as wave springs, that presses semiconductor elements of different heights to ensure tight contact with a heat dissipation unit, utilizing a heat sink and interface material for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor elements are fixed by screw or bolt, then the structure is simple and easy to manufacture, but the heat dissipation performance is unstable due to varying heights of semiconductor elements
Solution Approach 1:
The patent changes the physical state of the pressing member from rigid to elastic, allowing it to deform and adapt to varying semiconductor element heights. This elastic deformation enables consistent contact pressure and reliable heat dissipation across elements of different heights, resolving the contradiction between reliability and structural simplicity.
Solution Approach 2:
The pressing member is designed as an elastic component that can dynamically adjust its shape and pressure distribution based on the actual height variations of semiconductor elements. This dynamic adaptation ensures stable heat dissipation contact without requiring complex adjustment mechanisms.
2Reliability
If metal strip is used to press semiconductor elements, then assembly is simple, but insufficient contact pressure is applied to elements of different heights resulting in inefficient heat dissipation
Solution Approach 1:
The pressing member transitions from a rigid metal strip to an elastic component capable of deformation. This parameter change allows the pressing member to conform to height variations and apply sufficient contact pressure to all semiconductor elements simultaneously, achieving efficient heat dissipation while maintaining assembly simplicity.
3Adaptability or versatility
If IGBT chip is operated under high temperature and low temperature rapidly, then the device can handle thermal cycles, but the plastic insulant deteriorates and embrittles causing poor contact with heat dissipation unit
Solution Approach 1:
The elastic pressing member serves as a cushioning element that compensates for the embrittlement and dimensional changes of the plastic insulant after thermal cycling. By providing continuous elastic pressure, it ensures maintained contact between the semiconductor element and heat dissipation unit, preventing poor contact caused by material deterioration.
Solution Approach 2:
The elastic pressing member's ability to deform allows it to accommodate changes in the semiconductor element's dimensions and contact surface caused by thermal cycling and material embrittlement. This parameter adaptation maintains reliable thermal contact despite the deteriorating plastic insulant.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves heat dissipation efficiency, reduces the risk of damage, and simplifies assembly by ensuring consistent contact and increased lifespan of semiconductor elements.
Implementation Method 1
The elastic element is sandwiched between the electronic element and the fixing member, wherein the fixing member and the elastic element press the electronic element to make the electronic element tightly contact the heat dissipation unit
Implementation Method 2
The heat sink (fins) 23 is made of a high heat conductive material, such as copper or aluminum
Data Source
AI summary
A mounting structure for fixing an electronic element on a heat dissipation unit is provided. The mounting structure includes a heat dissipation unit, a fixing member, electronic elements and elastic elements. The fixing member is fixed on the heat dissipation unit. The elastic elements are sandwiched between the electronic elements and the fixing member, wherein the fixing member and the elastic elements press the electronic elements to make the electronic elements tightly contact the heat dissipation unit.